Nitto Electric Industrial Co., Ltd.

Nitto-denko Corporation

Nitto Electrical Industrial

Kiyohiro Kamei

Ichiro Ijichi

Yutaka Hori

Takashi Tominaga

Makoto Sunakawa

Takahumi Sakuramoto

Hidekazu Takahashi

Kunio Nagasaki

Toshiharu Konishi

Eishi Asoshina

Kaoru Aizawa

Michirou Kawanishi

Gosei Uemura

Souji Nishiyama

Yoshiki Kobayashi

Kyoichi Araki

An adhesive film comprising a ceramic powder and an adhesive composition having pressure-sensitive properties at room temperature (20.degree. C.), and a process for producing a multilayered ceramic structure, such as multilayered ceramic substrates, laminated ceramic capacitors, etc. using the adhesive film, are disclosed.

Process for producing a multilayered ceramic structure using an adhesive

An electronic component carrier includes an elongated substrate having a series of electronic component-setting portions spaced from one another at a predetermined interval along the length of the substrate. The substrate has push bar-insertion holes formed therethrough and disposed respectively at the electronic component-setting portions. Adhesive layers are formed respectively on surfaces of the electronic component-setting portions. The electronic components are adapted to be bonded respectively to the electronic component-setting portions through the adhesive layers. A push bar is adapted to be inserted into the push bar-insertion hole so as to be engaged with the electronic component to release the same from the adhesive layer.

Electronic component carrier

A composition for fixing metal powder molding at sintering, which is used, in the case of disposing a metal powder molding formed by rolling a mixture of a metal powder and a synthetic resin-based binder on a metal base material and sintering the metal powder molding in a non-oxidizing atmosphere, to adhere and fix the metal powder molding onto the base material until the metal powder molding is sintered by interposing between the metal powder molding and the base material, comprising a thermosetting resin composition containing a mixture of a thermosetting resin and at least one member selected from the group consisting of a metal fine powder, a thermoplastic resin and an adhesive material, wherein the amount of the residual carbon of the composition after completion of sintering is at least about 0.5% by weight.

Process for fixing metal powder molding at sintering

A heat-curable multilayer composite sheet comprising a layer comprising one or more unsaturated compounds which are normally solid or liquid free radical reactive unsaturated compounds and a layer comprising a normally solid or liquid free radical initiator, the layers being bonded to each other as a laminate as separate layers at a temperature at which the free radical initiator does not lose its free radical reaction-initiating capability, and, a process for preparing a heat-curable multilayer composite sheet, which comprises coating a layer-forming material containing a normally solid or liquid free radical reactive unsaturated compound on a strippable sheet to form an unsaturated compound material layer on the strippable sheet, coating a layer-forming material containing a normally solid or liquid free radical initiator on a strippable sheet to form a free initiator layer on the strippable sheet, bringing the unsaturated compound material layer into contact with the free radical initiator layer, and bonding them to each other at a temperature at which the free radical initiator layer does not lose its free radical reaction initiating ability.

Heat-curable composite sheet and process for forming the same

A heat-curable multilayer composite sheet comprising a layer comprising one or more unsaturated compounds which are normally solid or liquid free radical reactive unsaturated compounds and a layer comprising a normally solid or liquid free radical initiator, the layers being bonded to each other as a laminate as separate layers at a temperature at which the free radical initiator does not lose its free radical reaction initiating capability, and,

Heat-curable composite adhesive sheet and method for making

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Osaka, Japan

Kiyohiro Kamei