Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kiyohide Tatsumi

Yoshihiro Kawakita

Shinji Nakamura

Toshihiro Nishii

Toshiaki Takenaka

Tadashi Tojo

Hideaki Komoda

Yasuharu Fukui

After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.

Circuit board

A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

Circuit-formed substrate and method of manufacturing circuit-formed substrate

In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.

Method of manufacturing printed wiring boards

Method for producing a circuit board

Growing community of inventors

Ikoma, Japan

Kiyohide Tatsumi