Fujitsu Media Devices Limited

Fujitsu Media Devices Limted

Kiyohide Misawa

Masanori Ueda

Hiroyuki Furusato

Osamu Kawachi

Toshio Nishizawa

Osamu Kawauchi

A surface acoustic wave device includes a package having a coefficient of linear expansion; and a piezoelectric element forming a surface acoustic wave element, and mounted on the package by a flip chip bonding. The piezoelectric element has different coefficients of linear expansion in a direction of propagation of surface acoustic waves generated by an interdigital electrode of the surface acoustic wave element and in a vertical direction thereto, and further has a long side existing to a direction having a coefficient of linear expansion close to the coefficient of linear expansion of the package. The piezoelectric element is cut out from a single crystal having X, Y, and Z crystal axes, and the X crystal axis agrees with a direction of propagation of the surface acoustic wave.

Surface acoustic wave device, communication device using the same, and antenna duplexer

A SAW device includes a piezoelectric substrate and a package body holding the piezoelectric substrate, wherein the package body includes a bottom part carrying the piezoelectric substrate in a face-down state and a side wall part laterally surrounding the piezoelectric substrate, the bottom part carrying a wiring pattern for electrical connection with an electrode pattern on the piezoelectric substrate, the wiring pattern including a first ground pattern and a second ground pattern in a mutually separated relationship, the first ground pattern and the second ground pattern being connected electrically with each other.

Surface-acoustic-wave device for flip-chip mounting

Growing community of inventors

Nagano, Japan

Kiyohide Misawa