Daicel Chemical Industries, Ltd.

Daicel Corporation

Other

Japan Science and Technology Corporation

Kiyoharu Tsutsumi

Yoshinori Funaki

Keizo Inoue

Masamichi Nishimura

Akira Takaragi

Takahiro Iwahama

Tomoaki Mahiko

Naoko Araki

Shinya Nagano

Hiroki Tanaka

Jiichiro Hashimoto

Yousuke Ito

Koji Asakawa

Naomi Shida

Toru Ushirogouchi

Hiroto Miyake

Takeshi Okino

Takeji Hashimoto

Hiroshi Koyama

Naoko Tsuji

Katsuhiro Nakaguchi

Masafumi Harada

Tomoko Adachi

Ryosuke Ieki

Provided is a sheet-like prepreg that has both a low coefficient of linear thermal expansion and high flexibility and offers excellent anti-warpage performance and cracking resistance. The sheet-like prepreg according to the present invention includes a curable composition and a sheet-like porous support impregnated with the curable composition. The sheet-like porous support is made from a material having a coefficient of linear thermal expansion of 10 ppm/K or less. The sheet-like prepreg gives a cured product having a glass transition temperature of &#x2212;60&#xb0; C. to 100&#xb0; C. The curable composition includes one or more curable compounds (A) and at least one of a curing agent (B) and a curing catalyst (C). The curable compounds (A) include an epoxide having a weight per epoxy equivalent of 140 to 3000 g/eq in an amount of 50 weight percent or more of the totality of the curable compounds (A).

Sheet-shaped prepreg

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: 

Adhesive agent

Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50&#xb0; C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50&#xb0; C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130&#xb0; C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130&#xb0; C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

Adhesive agent composition for multilayer semiconductor

Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, Rrepresents hydrogen atom or methyl group; Rrepresents hydrogen atom or an alkyl group; and 'A' represents a linear or branched chain alkylene group having 2 to 20 carbon atoms. 

Cationically polymerizable resin, cationically polymerizable resin composition, and cured products thereof

Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0&#xb0; C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rrepresents hydrogen atom or methyl group; Rto Reach independently represent a hydrocarbon group having 1 to 5 carbon atoms; 'a' is an integer of from 0 to 5; and 'b' is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment. 

Cationically polymerizable resin composition and cured object obtained therefrom

Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 &#xb0; C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description. 

Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof

A polycyclic ester containing a cyano group and a lactone skeleton, represented by following Formula (1): wherein Rrepresents, for example, a hydrogen atom or an alkyl group having one to six carbon atoms which may have a halogen atom; Rs each represent, for example, a halogen atom or an alkyl or haloalkyl group having one to six carbon atoms; 'm' is the number of Rs; 'n' is the number of cyano groups; and CH&#x2550;C(R)COO&#x2014; group may have either of an endo conformation and an exo conformation. Accordingly, there is provided a novel polycyclic ester containing a cyano group and a lactone skeleton which is useful typically as a monomeric component for highly functional polymers. A polymer, for example, derived from this compound is highly soluble in an organic solvent while remaining stable typically to chemicals and exhibits improved hydrolyzability and/or improved solubility in water after hydrolysis.

Polycyclic ester containing cyano group and lactone skeleton

Disclosed is a polycyclic ester containing a cyano group and a lactone skeleton, represented by following Formula (1): wherein Rrepresents, for example, a hydrogen atom or an alkyl group having one to six carbon atoms which may have a halogen atom; Rs each represent, for example, a halogen atom or an alkyl or haloalkyl group having one to six carbon atoms; 'm' is the number of Rs; 'n' is the number of cyano groups; and CH&#x2550;C(R)COO&#x2014; group may have either of an endo conformation and an exo conformation. Accordingly, there is provided a novel polycyclic ester containing a cyano group and a lactone skeleton which is useful typically as a monomeric component for highly functional polymers. A polymer, for example, derived from this compound is highly soluble in an organic solvent while remaining stable typically to chemicals and exhibits improved hydrolyzability and/or improved solubility in water after hydrolysis.

A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hydrocarbon group or R; R, R, Rand Rand are each independently a protected or unprotected carboxyl group, etc.; and Y, Y, Yand Yare each independently a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine derivative represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R, R, Rand Rare each a substituent bound to Ring Z and are each independently a protected or unprotected amino group, etc., dissolved in the organic solvent.

Dielectric films and materials therefor

A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R, R, R, Rand Rare the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.

Polymer for photoresist and resin compositions therefor

A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y, Y, Yand Yare the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2):wherein Ring Z is a monocyclic or polycyclic aromatic ring; and Rand Rare each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent  

A polymeric compound for photoresist of the present invention includes a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton in the structure. The monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton includes a monomer unit represented by the following Formula (I):wherein R is a hydrogen atom or a methyl group. The polymeric compound for photoresist may include a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having a group of adhesion to substrate, and a monomer unit having an acid-eliminating group. The polymeric compound for photoresist of the present invention exhibits not only adhesion to substrate, acid-eliminating property and resistance to dry-etching but also has well-balanced solubility in solvents for photoresist and alkali-soluble property.

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Himeji, Japan

Kiyoharu Tsutsumi