Kuraray Co., Ltd.

Kiyofumi Kadowaki

Mitsuru Kato

Chihiro Okamoto

Shinya Kato

Minori Takegoshi

There is used a polyurethane for polishing layers that can be used as a material of a polishing layer of a polishing pad, the polyurethane including a thermoplastic polyurethane that is a reaction product of a polyurethane raw material including a polymer diol, an organic diisocyanate, and a chain extender, wherein the chain extender contains 50 mass % or more of a first chain extender including a straight-chain carbon backbone having 7 to 12 carbon atoms.

Polyurethane for polishing layer, polishing layer, and polishing pad

Disclosed is a non-porous molded article for a polishing layer, the non-porous molded article including a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum value of a loss tangent (tan &#x3b4;) in a range of &#x2212;70 to &#x2212;50&#xb0; C. of 4.00&#xd7;10or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 5.7 to 6.5 mass %.

Non-porous molded article for polishing layer, polishing pad, and polishing method

Disclosed is a polishing-layer molded body including: a thermoplastic polyurethane that is a polymer of a monomer including: a polymer diol; an organic diisocyanate; a first chain extender including a diol having 4 or less carbon atoms; a second chain extender including a diol having 5 or more carbon atoms, a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate being 6.3 to 7.4 mass %, and the polishing-layer molded body being non-porous.

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Kurashiki, Japan

Kiyofumi Kadowaki