Seiko Instruments Inc

Ablic Inc.

Kiyoaki Kadoi

Yoshikazu Kojima

Kazutoshi Ishii

Naoto Inoue

Shoji Nakanishi

Yasuhiro Moya

Kentaro Kuhara

Takao Akiba

Koushi Maemura

Noriyuki Kimura

A current detection device includes a main busbar and a semiconductor chip. A detected current flows through the main busbar. The semiconductor chip is spaced apart from the main busbar. The semiconductor chip includes a branch busbar, a detection part, and an output part. The branch busbar is connected in parallel with the main busbar. The detection part is arranged adjacent to the branch busbar and detects a first magnetic field generated based on a branch current flowing from the main busbar to the branch busbar. The output part calculates and outputs a current value based on the first magnetic field detected by the detection part.

Current detection device

In a semiconductor device (), a semiconductor chip () is mounted on a die pad () which has a die pad overhang portion () and leads () are arranged around and apart from the die pad (). The leads () and the semiconductor chip () are electrically connected and are covered with a sealing resin (). A concave portion () is formed on the outer side of each lead (), i.e., the far side from the die pad. A lead concave surface () facing the concave portion () includes a forward-tapered lead slope surface (). Side surface of the sealing resin () has a step of a staircase shape formed from the first and the second resin side surfaces (and). A tip of the lead () protrudes past the first resin side surface ().

Semiconductor device and method of manufacturing the semiconductor device

Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.

Semiconductor device and electronic apparatus

A surface of a lead frame of a semiconductor device package, on which a semiconductor chip is mounted, is formed to have a mesh structure, whereby a connecting area between the lead frame and a molding resin can be increased to have strong bonding. Further, only filler particles having a small diameter than the mesh are taken into the vicinity of the lead frame, suppressing the effect of stresses to reduce deformation of the lead frame.

Semiconductor device package

A dicing blade () which rotates at high speed is surrounded by a case (). A semiconductor wafer () is cut by a dicing device in which the case is filled with a cooling water (). The case () is provided with a cooling water nozzle () for continuously supplying the cooling water and a gap () for discharging the cooling water out of the case. By adjusting a supply rate and a discharge rate of the cooling water, a proper water pressure can be applied to an inside of the case, thereby making it possible to cool the dicing blade and the cutting point with efficiency. As a result, it is possible to suppress chipping and cracking of the semiconductor device due to lack of cooling.

Dicing method using an encased dicing blade submerged in cooling water

In a semiconductor device, a metal wiring film and a lower-layer film under a bump electrode are patterned to form irregular steps under the bump electrode. With the formation of the irregular steps, the contact area of the bump electrode with a semiconductor substrate is increased to improve the mechanical strength. The lower-layer film is formed of a polysilicon film, an insulating film or a protective film such as a silicon nitride film, or Al&mdash;Si&mdash;Cu, Al&mdash;Si, Al&mdash;Cu or Cu. A portion where irregular steps are formed is in a region under the bump except for a protective film opening portion.

Semiconductor device having a bump electrode

To decrease the area of a chip, improve the manufacturing efficiency and decrease the cost in a semiconductor device such as a driver integrated circuit having a number of output pads, and an electronic circuit device such as electronic clock. There are disposed output pads superposed in two dimensions on driving transistors or logic circuits connected thereto, respectively. Further, not only aluminum interconnection but also bump electrodes or barrier metals are used for the interconnection of the semiconductor device. In a case where a semiconductor integrated circuit is electrically adhered on to a printed circuit board in a face down manner, a solder bump disposed on the semiconductor integrated circuit and the interconnection of the printed circuit board are directly connected to each other, thereby realizing the electrical connection. On this occasion, the bump electrode as the external connecting terminal of the semiconductor integrated circuit is laminated on the transistor.

Growing community of inventors

Chiba, Japan

Kiyoaki Kadoi