Ebara Corporation

Kiwamu Tsukamoto

Takeshi Murakami

Masahiro Hatakeyama

Shoji Yoshikawa

Yukio Fukunaga

Hiroyuki Shinozaki

Kenji Watanabe

Kuniaki Horie

Tsutomu Karimata

Kenji Terao

Yoshihiko Naito

Yasushi Toma

Tatsuya Kohama

Takehide Hayashi

Yuji Araki

Hidenao Suzuki

Mitsunao Shibasaki

Norio Kimura

Akihisa Hongo

Tsutomu Nakada

Hiroshi Sobukawa

Hiroyuki Ueyama

Kenichi Suematsu

Ryo Tajima

Masahito Abe

Noriyuki Takeuchi

Noboru Kobayashi

Naoaki Ogure

Shinichi Okada

Masaru Nakaniwa

Masao Saitoh

Kenji Kamoda

Shinya Uemura

Hirotake Yamagishi

Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.

Electron-beam irradiated area adjustment method and adjustment system, electron-beam irradiated region correction method, and electron beam irradiation apparatus

An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

Inspection device

A surface processing apparatus is an apparatus which performs surface processing on an inspection objectby irradiating the inspection object with an electron beam. A surface processing apparatus includes: an electron source(including lens system that controls beam shape of electron beam) which generates an electron beam; a stageon which an inspection objectto be irradiated with the electron beam is set; and an optical microscopefor checking a position to be irradiated with the electron beam. The current value of the electron beam which irradiates the inspection objectis set at 10 nA to 100 A.

Surface processing apparatus

An inspection apparatus capable of facilitating reduction in cost of the apparatus is provided. The inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held on a movable stage in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The inspection apparatus further includes: a linear motor that drives the movable stage; and a Helmholtz coil that causes a magnetic field for canceling a magnetic field caused by the linear motor when the movable stage is driven.

Inspection apparatus

An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage () on which a sample () is placed is disposed inside a vacuum chamber () that can be evacuated to vacuum, and a dust collecting electrode () is disposed to surround a periphery of the sample (). The dust collecting electrode () is applied with a voltage having the same polarity as a voltage applied to the sample () and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate () having a through hole () at the center above the sample () and the dust collecting electrode ().

Electro-optical inspection apparatus and method with dust or particle collection function

An inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The primary optical system includes a photoelectron generator having a photoelectronic surface. The base material of the photoelectronic surface is made of material having a higher thermal conductivity than the thermal conductivity of quartz.

An inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The primary optical system includes a photoelectron generator having a photoelectronic surface. The base material of the photoelectronic surface is made of material having a higher thermal conductivity than the thermal conductivity of quartz. A central portion of the inspection object is provided with a central flat portion. The periphery of the central flat portionis provided with peripheral flat portionvia a step. The periphery of the stepis provided with an electric field correction plate. A surface voltage equivalent to a surface voltage applied to the inspection object is applied to an electrodeon the electric field correction plate

An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.

A positive displacement liquid-delivery apparatus includes a positive displacement pump and a differential pressure control unit The positive displacement pump includes a liquid-delivery chamber having a watertight housing with one part formed of a flexible diaphragm and a diaphragm driver linked to the diaphragm for deforming the same to discharge fluid from the liquid-delivery chamber The differential pressure control unit uniformly controls the differential pressure inside and outside the diaphragm during the pumping process.

Positive displacement type liquid-delivery apparatus

A substrate processing apparatus forms a thin film of high-dielectric or ferroelectric such as barium/strontium titanates, or a copper film for wiring on a substrate, and has a gas ejection head for individually introducing at least two gases including a material gas and ejecting the gases toward a substrate to be processed. The gas ejection head has at least two gas passageways for individually introducing the two gases, and at least two temperature control devices for individually controlling temperatures of the gases flowing through the gas passageways.

Apparatus and method for processing substrate

A compact thin-film deposition apparatus can promote a stable growth of a high quality thin-film product of uniform quality. The apparatus comprises a vacuum-tight deposition chamber enclosing a substrate holding device for holding a substrate. An elevator device for moving the substrate holding device and a gas showering head for flowing a film forming gas towards the substrate are provided. A transport opening and an exhaust opening are provided on a wall section of the deposition chamber at a height corresponding to the transport position and the deposition position, respectively. The deposition chamber is provided with a flow guiding member, and the flow guiding member comprises a cylindrical member to surround an elevating path of the substrate holding device and a first ring member to vertically divide a chamber space at a height between the exhaust opening and the transport opening.

Thin-film deposition apparatus

A valving device can operate stably to provide switching or flow rate control operations, even when it is used for controlling thermodynamically unstable gases. The valving device including a valve casing having an internal passage for process fluids. A valve body is movable against a valve seat for adjusting opening of the internal passage, and a valve driving mechanism can drive the valve body. A flexible member is provided for separating a fluid handling space including the internal passage from a valve mechanism space for housing the valve driving mechanism. A thermal medium space is formed within the valve mechanism space for receiving a thermal medium for providing heat to the valve body.

Valving device

A thin-film vapor deposition apparatus has a reaction chamber for holding therein a substrate in an atmosphere isolated from an ambient atmosphere. For depositing a thin film on the substrate, the temperature of an inner wall of the reaction chamber is adjusted to control the temperature of the atmosphere in the reaction chamber, and the temperature of the substrate is also adjusted independently of the temperature of the atmosphere in the reaction chamber, while the substrate is being rotated at a high speed in the reaction chamber. Reactant gases required to deposit a thin film on the substrate are ejected from a reactant gas elector head toward the substrate in the reaction chamber. Remaining and excessive gases are discharged out of the reaction chamber.

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Tokyo, Japan

Kiwamu Tsukamoto