Nippon Steel Chemical Co., Ltd.

Kiwamu Tokuhisa

Akira Tokumitsu

Masashi Kaji

Hironobu Kawasato

Kazuhiko Nakahara

Isamu Takarabe

Kentaro Hayashi

Hongyuan Wang

Akira Mori

Kazuaki Kaneko

Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250&#xb0; C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Flame-retardant adhesive resin composition and adhesive film using the same

The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; Rrepresents alkyl group having 1 to 6 carbon atoms or phenyl group; Rrepresents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; Rrepresents a divalent group or a direct bond; Rrepresents &#x2014;CH&#x2550;CH&#x2014;R&#x2014;, in which Rrepresents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; Rrepresents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.

Photosensitive resin composition and circuit substrate employing the same

This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30&#x2013;95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5&#x2013;70 mol % of a siloxanediamine (B2) as essential components.

Siloxane-modified polyimide resin

An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250&#x25a1;C and a Young's modulus (storage modulus) at 250&#x25a1;C of 10Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270&#x25a1;C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

Adhesive polyimide resin and adhesive laminate

This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.

Growing community of inventors

Kisarazu, Japan

Kiwamu Tokuhisa