Semiconductor Components Industries, LLC

Kisun Lee

Michael A Stapleton

Gary Horst Loechelt

Gang Chen

Paul Jay Harriman

Yenting Wen

Gabor Reizik

A semiconductor component and a method for manufacturing the semiconductor component. In accordance with an embodiment, the semiconductor component includes a plurality of stacked semiconductor chips mounted to a support structure, wherein one semiconductor chip has a side with a plurality of electrical contacts electrically coupled to conductive tabs of the support structure. An electrical connector electrically connects an electrical contact formed from a side opposite the side with the plurality of electrical contacts to a corresponding conductive tab. Another semiconductor chip is mounted to the electrical connector and electrical contacts formed from this semiconductor chip are electrically connected to corresponding conductive tabs of the support structure.

Semiconductor component and method of manufacture

In one embodiment, a method of forming a multi-channel power supply controller includes forming a plurality of channels configured to regulate an output voltage between first and second values, configuring the controller to select a channel that has a lowest current value and initiate forming a drive signal for that channel responsively to the output voltage having a value that is less than the first value, configuring a reset circuit for each channel to terminate the respective drive signal responsively to at least the output voltage having a value greater than the first value.

Multi-phase power supply controller and method therefor

In accordance with an embodiment, a modulator includes a comparator and ramp generating circuitry. A first comparison signal is generated in response to comparing a first input signal with a compensation signal. A second comparison signal is generated in response to comparing a second input signal with the compensation signal. A first latch signal is generated in response to the first comparison signal and a second latch signal is generated in response to the second comparison signal.

Method for generating a signal and structure therefor

A semiconductor component and a method of manufacturing the semiconductor component that reduces parasitic elements. A semiconductor chip is coupled to a semiconductor chip receiving area of a support structure. The semiconductor chip has at least two power semiconductor devices. A drain contact of a first power semiconductor device is coupled to a source contact of a second power semiconductor device and the drain and source contacts of the first and second power semiconductor devices are joined to the semiconductor chip receiving area. Another semiconductor chip may be bonded to a second semiconductor chip receiving area of the support structure. An energy storage element may be coupled between the source contact of the first power semiconductor device and the drain contact of the second semiconductor device. A protective structure may be formed over the semiconductor chips and the energy storage element.

Method for manufacturing a semiconductor component and structure therefor

A multi-phase power converter and a method for balancing a plurality of currents in the multi-phase power converter. The multi-phase power converter has a pulse width modulation circuit, a current ordering circuit, and a plurality of currents, wherein each current of the plurality of currents has an associated phase. The converter determines the phase associated with one or more currents of a plurality of currents and whether a phase associated with one or more currents of the plurality of currents is active. The current levels of the plurality of currents are determined and a phase associated with a current having one of a lowest current level or a highest current level is activated.

Growing community of inventors

Hwasung-si, South Korea

Kisun Lee