Lg Electronics Inc.

Abxign, Inc.

Kisu Kim

Sangwook Park

Younghyun Lee

Changseo Park

Seunghwan Shim

Yuju Hwang

Ilhyoung Jung

Jinhyung Lee

Giwon Lee

Eunae Yoon

Jeongbeom Nam

Philwon Yoon

Jongdae Kim

Yongil Shin

Ilhwan Kim

Jinah Kim

Dohee Kim

Jungsub Kim

Gunho Kim

Dohwan Yang

Seongmin Moon

Younho Heo

Eunhye Youn

Junho Chung

A method for manufacturing a display device according to the present invention is characterized by comprising the steps of: supplying semiconductor light-emitting elements in a first chamber containing a fluid; disposing a distribution device, in which a plurality of magnets are arranged, on one side of the first chamber; rotating the distribution device such that the semiconductor light-emitting elements form a continuous pattern along the arrangement direction of the plurality of magnets; and stopping the distribution device such that the semiconductor light-emitting elements are distributed to a plurality of dummies, wherein in the step of stopping the distribution device, the plurality of dummies are formed at positions corresponding to the plurality of magnets.

Method for manufacturing display device

Discussed is a display device including a base portion; a first electrode formed on the base portion; a dielectric layer stacked on one surface of the first electrode; a second electrode disposed on the dielectric layer at a predetermined interval; a barrier rib portion stacked on the dielectric layer to cover the second electrode while forming a plurality of cells; and semiconductor light emitting diodes seated in the plurality of cells, wherein the first electrode is spaced apart from the second electrode with the dielectric layer disposed therebetween.

Display device having semiconductor light emitting diodes seated in a plurality of cells, and method for manufacturing the display device

Discussed is a display device including a base portion; a first electrode formed on the base portion; a barrier rib portion stacked on the first electrode while forming a plurality of cells; a second electrode formed on the barrier rib portion; and semiconductor light emitting diodes seated in the plurality of cells, wherein the first electrode and the second electrode are spaced apart from each other with the barrier rib portion disposed therebetween.

Display device using semiconductor light-emitting element seated in plurality of cells of barrier rib portion

A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

Apparatus and method for self-assembly of semiconductor light-emitting element

A semiconductor light emitting diode self-assembling device according to the present invention comprises: an assembly chamber in which fluid and semiconductor light emitting diodes are received; a magnetic chuck disposed above the assembly chamber and applying, while moving in a horizontal direction, a magnetic force thereto so as to induce movement of the semiconductor light emitting diodes in the assembly chamber; a substrate chuck for placing an assembly substrate, on which the semiconductor light emitting diodes in the assembly chamber are seated, between the assembly chamber and the magnetic chuck and supporting the assembly substrate; and a control part for controlling the driving of the magnetic chuck and the substrate chuck, wherein the magnetic chuck includes: a magnetic force forming part including a plurality of magnets; and a vacuum forming part for correcting a bending phenomenon of the assembly substrate by using vacuum pressure between the plurality of magnets so as to maintain a predetermined interval between one side of the magnetic chuck and the assembly substrate.

Apparatus and method for self-assembling semiconductor light emitting diodes

A display manufacturing apparatus includes a foreign substance removal device and an assembly device. The foreign substance removal device removes foreign substances from a plurality of semiconductor light emitting devices. The assembly device assembles the plurality of removed semiconductor light emitting devices on a display substrate. The foreign substance includes magnetic foreign substance and non-magnetic foreign substance. The foreign substance removal device includes a first module for filtering non-magnetic foreign substance among the foreign substance of the plurality of semiconductor light emitting devices, and a second module for filtering magnetic foreign substance among the foreign substances of the plurality of semiconductor light emitting devices.

Display manufacturing apparatus

Discussed in an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including: a base part; a plurality of pair electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of pair electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of pair electrodes so as to overlap portions of the plurality of pair electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein at least one of a recess portion and a concave and convex portion is formed on an upper surface of each of the partition walls.

Substrate for manufacturing display device and method for manufacturing display device

A solar cell includes a substrate formed of n-type single crystal silicon, an emitter region of a p-type which is positioned at a first surface of the substrate and includes a first emitter region having a first sheet resistance and a second emitter region having a second sheet resistance less than the first sheet resistance, a plurality of surface field regions of the n-type locally positioned at a second surface opposite the first surface of the substrate, a plurality of first electrodes which are positioned only on the second emitter region to be separated from one another and are connected to the second emitter region, and a plurality of second electrodes which are positioned on the plurality of surface field regions to be separated from one another and are connected to the plurality of surface field regions.

Solar cell and method for manufacturing the same

A solar cell is discussed, which includes a tunneling layer on one surface of a semiconductor substrate; a first conductive type region on the tunneling layer; a second conductive type region on the tunneling layer; a first electrode and a second electrode, the first electrode connected to the first conductive type region and the second electrode connected to the second conductive type region. The tunneling layer includes a first portion and a second portion. The first portion is disposed to correspond to at least a part of the first and second conductive type regions and has a first thickness. At least a part of the second portion is disposed to correspond to a boundary portion between the first conductive type region and the second conductive type region. The second portion has a second thickness greater than the first thickness.

Solar cell

A method for manufacturing a solar cell includes forming a conductive type region on one surface of a semiconductor substrate, and forming an electrode on the conductive type region, wherein the forming of the electrode includes forming a metal layer on an entire area of the conductive type region, forming a printed electrode layer having a pattern on the electrode layer, and forming an electrode layer between the conductive type region and the printed electrode layer, wherein the forming of the electrode layer includes patterning the metal layer by using the printed electrode layer as a mask.

A solar cell includes a semiconductor substrate of a first conductive type, an emitter region having a second conductive type different from the first conductive type and positioned at a first surface of the semiconductor substrate, a semiconductor region positioned directly on a second surface opposite the first surface of the semiconductor substrate, forming a charge accumulation layer on the second surface of the semiconductor substrate, and containing impurities of the first conductive type, a first electrode positioned on the first surface of the semiconductor substrate and coupled to the emitter region, and a second electrode positioned on the second surface of the semiconductor substrate and coupled to the semiconductor substrate.

A solar cell is discussed. A solar cell includes a semiconductor substrate, a conductive type region on one surface of the semiconductor substrate, and an electrode connected to the conductive type region. The electrode includes an electrode layer on the conductive type region and a printed electrode layer on the electrode layer.

A method of manufacturing a solar cell includes: forming a dopant layer by doping a dopant to a semiconductor substrate; and forming an electrode electrically connected to the dopant layer. The forming of the electrode includes forming a metal layer on the dopant layer; and heat-treating the metal layer to form a first layer and a second layer. In the heat-treating of the metal layer, a portion of the metal layer adjacent to the semiconductor substrate forms the first layer including a compound formed by a reaction of the metal layer and the semiconductor substrate, and a remaining portion of the metal layer forms the second layer that covers the first layer.

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Seoul, South Korea

Kisu Kim