Apple Inc.

Kishore N Renjan

Manoj Vadeentavida

Bilal Mohamed Ibrahim Kani

Kyusang Kim

Pierpaolo Lupo

David M Kindlon

Benjamin J Grena

Lan H Hoang

Praveesh Chandran

Ali N Ergun

Phillip R Sommer

Prashanth S Holenarsipur

Yuta Kuboyama

Scott D Morrison

Takayoshi Katahira

Jing Tao

Vinodh Babu

Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.

Technologies for increased volumetric and functional efficiencies of optical packages

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Sidewall connections and button interconnects for molded SiPs

Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

Built-in connector for board-to-board and flex-to-rigid board connection

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

Fabric-mounted components

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Packaging technologies for temperature sensing in health care products

Right angle sidewall and button interconnects for molded SiPs

Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

Embedded packaging concepts for integration of ASICs and optical components

Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.

Miniaturization of optical sensor modules through wirebonded ball stacks

A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.

Growing community of inventors

Singapore, Singapore

Kishore N Renjan