Nippon Telegraph and Telephone Public Corporation

Mitsubishi Denki Kabushiki Kaisha

Sumitomo Metal Mining Company, Ltd.

Nippon Telecommunication Engineering Company

Nippon Bell Parts Co., Ltd.

Nihon Telecommunication Engineering Corporation

Kishio Arita

Toshio Takahashi

Koichi Fujiwara

Shigeyuki Tsurumi

Goro Yamauchi

Hiroji Tanaka

Akio Miyoshi

Masataka Hirai

Takashi Kozakai

Yoshitaka Koide

Kiyoshi Murakawa

Haruzi Sato

Shugo Kubo

Susumu Mitani

Yoshio Habuka

Hajime Izumimori

Mitsushi Ishida

Yoshikazu Sudo

Coro Yamauchi

Hideo Sakai

In an ultrasonic inspecting apparatus, propagation time is measured between a transmitting point of an ultrasonic wave from outer circumference of a subject material and a receiving point of the ultrasonic wave at another point on the outer circumference spaced apart from the transmitting point by a predetermined angle, and a predetermined sequence of operations is performed with the measured propagation times and the known constants, thereby internal information concerning the material, including location and shape of a defect existing therein, is provided.

Ultrasonic inspecting apparatus

A copper alloy which is high in strength and electroconductivity is manufactured by casting, without chill casting, a copper alloy mass substantially consisting of copper and containing 0.2 to 1.5% by weight of chromium and 0.01 to 0.5% by weight of tin, hot working the cast copper alloy mass, then cooling, not slowly, the hot worked alloy mass without being subjected to any solid solution treatment, further cold working the cooled alloy mass, and thereafter subjecting the cold worked alloy mass to an aging treatment.

Method for manufacture of high-strength high-electroconductivity copper

Copper-nickel-tin alloys having high tensile strength and conductivity suitable for lead conductor materials for integrated circuits are produced by melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.2% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si other than Cu, casting the molten metal, rolling conventionally the cast into a sheet having a thickness corresponding to more than 60% of cold reduction rate of the final necessary gauge, annealing such a rolled sheet at a temperature of 300-395.degree. C. for 1 hour, cold rolling the annealed sheet and annealing the cold rolled sheet at a temperature of 150-250.degree. C. for 1 hour.

Copper-nickel-tin alloys for lead conductor materials for integrated

An electrical contact material and method of producing the same are provided. The material is an internally oxidized silver eutectic alloy system with a main component of silver to which at least one of silicon and germanium is added and, for characteristic improvement purpose, at least one selected from at least one of the groups consisting respectively of gold, platinum and the like, titanium, rhenium and the like, and iron, cobalt and the like is further added. In producing the material, an ingot of said alloy is hot-worked and then internally oxidized at a temperature in a range from 250.degree. C. to the eutectic temperature of the alloy.

Electric contact material and method of producing the same

Electrical contact material

Manufacture of an aluminum-aluminum oxide dispersion composite conductive material (hereinafter referred to as Al-Al.sub.2 O.sub.3 dispersion composite conductive material) by compacting aluminum powder prepared by the atomization method, the particles having an oxide film with a thickness of about 100 A, and heat-treating the resultant compacted material in a vacuum or in a reducing gas or inert gas atmosphere at a temperature of 660.degree. to 700.degree.C. The composite conductive material thus obtained has a structure, in which the aluminum oxide is uniformly dispersed in aluminum, and it is capable of high speed wire drawing. Its electrical conductivity is 56.5 to 63.2 percent IACS (International Annealed Copper Standard), and its aluminum oxide content is 0.01 to 0.2 weight percent.

Production of aluminum-aluminum oxide dispersion composite conductive

Growing community of inventors

Mito, Japan

Kishio Arita