Applied Materials, Inc.

Kirubanandan Naina Shanmugam

Steven D Marcus

Hanish Kumar Panavalappil Kumarankutty

Senthil Kumar Nattamai Subramanian

Michael Robert Rice

David Walter Groechel

Li Wu

Gayatri Natu

Shawyon Jafari

Chidambara A Ramalingam

Dorothea Buechel-Rimmel

Nikshep M Patil

Avishek Ghosh

Subhaschandra Shreepad Salkod

Moin Ahmed Khan

Madhukar Krishna

Sriharsha Dharmapura Sathyanarayanamurthy

Palash Joshi

Shivaprakash Padadayya Hiremath

Sankar Menon Cherubala Pathayapura

Yogesh Tomar

Katty Guyomard

Embodiments of an apparatus for coating a plurality of gas lines are provided herein. In some embodiments, an apparatus for coating a plurality of gas lines via an ALD process includes: an oven having an enclosure that defines an interior volume configured to house the plurality of gas lines, the enclosure having a door configured for transferring the plurality of gas lines into and out of the interior volume; a plurality of inlet ports disposed through a first wall of the enclosure; a plurality of exhaust ports disposed through a second wall of the enclosure; a fluid panel disposed outside of the oven and coupled to the plurality of inlet ports via corresponding ones of a plurality of fluid distribution assemblies; and a foreline disposed outside of the oven and coupled to the plurality of exhaust ports.

Atomic layer deposition coating system for inner walls of gas lines

Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.

Atomic layer deposition part coating chamber

Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

Semiconductor chamber component cleaning systems

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Bengaluru, India

Kirubanandan Naina Shanmugam