Motorola Corporation

Kiron P Gore

Kevin L Haas

Grace M O'Malley

Sanjar Ghaem

Vahid Kazem-Goudarzi

Edward J Hall

Steven Lustig

Benjamin J Hafen

Sang Oh

Thomas A Goodwin

Everett Alan Clayton

Alan E Clayton

Timothy J Dinwiddie

Dee Newton

Steven T Bogert

Robert A Charles

Charles Gray

Hai Teo

Vinay Gondotra

John B Brinkerhoff

A module ( ) for use with a smart card ( ) is disclosed. The module ( ) includes a substrate ( ) having a first side ( ) and a second side ( ). The first and second sides each have deposited thereon a metallic layer ( ), with the substrate ( ) having a thickness of about 125 microns. A die ( ) is mounted adjacent the substrate first side ( ), with the die ( ) being coupled to the substrate first side ( ) by a plurality of wire leads ( ). A protective coating ( ) covers the die ( ), with the module having a total thickness of about 525 microns.

Smart card module and method of assembling the same

A module ( ) for use with a smart card ( ) is disclosed. The module ( ) includes a substrate ( ) having a first side ( ) and a second side ( ). The first and second sides each have deposited thereon a metallic layer ( ), with the substrate (14) having a thickness of about 125 microns. A die ( ) is mounted adjacent the substrate first side ( ), with the die ( ) being coupled to the substrate first side ( ) by a plurality of wire leads ( ). A protective coating ( ) covers the die ( ), with the module having a total thickness of about 525 microns.

An improved punch out pattern for a hot melt tape used in smartcard manufacture. The hot melt tape is provided with punch out channels that direct the overflow of conductive adhesive away from the surface of the hot melt tape. In a preferred embodiment, the punch out channels are dimensioned to direct the overflow away from one another and toward a module receiving cavity formed in the smartcard body. In an alternate embodiment where it may not be feasible to direct overflow toward the overmold receiving cavity without affecting the electrical or mechanical performance of the smartcard, the punch out channels are dimensioned to direct overflow away from one another and along the periphery of the hot melt tape area. In either scenario, the channels do not interfere with module adhesion and, by virtue of the channeling of overfill matter, direct the conductive adhesive away from other connections in close vicinity and thus avoid the possibility of shorting.

Punch out pattern for hot melt tape used in smartcards

A card assembly (10) comprises a polymeric layer (16) having a generally planar surface (24), an integrated circuit component (38) adjacent to the polymeric layer (16), and a loop antenna (24) formed of a bare conductor (32) having ends. The loop antenna (24) comprises a first section (26) embedded into the polymeric layer (16), a second section (28) embedded into the polymeric layer (16), and a transverse section (30) spaced apart from the first section (26) by a dielectric region. The transverse section (30) crosses the first section (26). The ends (34) are electrically coupled to the integrated circuit component (38). The dielectric region preferably comprises a reflowed flash region of the polymeric layer (16) such that the transverse section (30) is encapsulated within the polymeric layer (16). Alternately, the dielectric region comprises a dielectric insert separating the transverse section from the first section.

Card assembly having a loop antenna formed of a bare conductor and

Portable data carrier

A pick-and-place apparatus (404) for magnetically and vacuum coupling an item (1100) includes a base (516), a magnetic coupler (500), and a vacuum coupler (502). The magnetic coupler (500) includes a vertical member (506) and a magnetic body (504), where the vertical member (506) has a first end (501) coupled to a center (507) of the base (516) and a second end (503) coupled to the magnetic body (504). The vacuum coupler (502) includes a first tubular member (510), a first vacuum cup (508), a second tubular member (514), and a second vacuum cup (512). The first tubular member (510) has a first end (509) coupled to a first end (517) of the base (516) and a second end (511) having the first vacuum cup (508) attached thereto. The second tubular member (514) has a first end (513) coupled to a second end (519) of the base (516) and a second end (515) having the second vacuum cup (512) attached thereto. The vertical member (506) of the magnetic coupler (500) is retractable for decoupling a magnetically coupled item.

Pick-and-place tool for vacuum and magnetic coupling

Labels (12) are disposed on a carrier strip (10), which is routed from a feed reel (22), over a guide (24), idlers (26 & 28), through a printer (30), over a peeler plate (32), and to a pick-up reel (34). The labels are cleaned of dust prior to printing by effectively rolling an adherent surface (36) over the printing surface (14) of each label as it moves past the guide.

Apparatus for cleaning labels and method therefor

A labeling head (22) has an applicator surface (24) having an outward curvature for holding a label (12) and applying it to a labeling surface (16) of an article (14). The labeling head is rotatable about a pivot pin (38) which passes through a pivot end (28) of the labeling head, allowing a free end (26) of the labeling head to be biased toward the article at an initial angle of bias, as determined by, for example, an adjustment screw (40). The initial angle of bias and the curvature of the labeling head are such that the portion of the label nearest the free end is parallel to the labeling surface. As the labeling head is lowered, the label is applied with a substantial rolling motion to avoid trapped air bubbles.

Labeling apparatus for applying labels with a rolling motion

An unwelded battery assembly (32) is fed to a shuttle (36) which moves the unwelded battery assembly (32) to a moveable platform (46) in a raised position. The platform lowers the battery assembly into a nest (44) which rigidly supports the battery assembly. An ultrasonic horn is lowered into contact with the battery assembly and welds the battery cover (16) to the battery housing (14). The welded battery assembly (57) is then raised out of the nest by the moveable platform (46), and is moved to a second stage (48) while another unwelded battery assembly is shuttled to the platform. A central control circuit (49) operates and synchronizes the apparatus.

Apparatus for ultrasonic welding of battery assemblies

A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit board. The locating features may comprise solder bumps (24) on the printed circuit board. The locating features are arranged on the surface of the printed circuit board to lie proximal to the main body (22) of the surface mount electronic component. The locating features prevent movement of the surface mount electronic component prior to soldering the surface mount electronic component to the printed circuit board.

Printed circuit assembly having component locating features

A shield (100) having a detachable grasp support member (140) is provided. The shield (100) includes a hollowed frame (110) having first and second surfaces (112, 114), and a cavity (130) extending from the first surface (112) to the second surface (114). A detachable grasp support member (140) is attached to the hollowed frame (110) and extends across at least a portion of the cavity (130). A second shield member (160) mounts onto the frame (110) and covers the cavity (130) along the first surface (112) to complete the shield (100).

Shield with detachable grasp support member

A gripper assembly for a robotic device includes a first vacuum nozzle (260) having a gripping surface (262), and a second vacuum nozzle (270) having a gripping surface (272). The first nozzle (260) is positioned within the second nozzle (270).

Vacuum gripper assembly for a robotic device

A method of preparing a component for automated placement is provided. The method includes disposing tacking medium on a substantially transparent member (210); engaging the tacking medium with the component (230); and imaging the component through the substantially transparent member (240).

Method of preparing a component for automated placement

A method for dispensing substantially moisture free electronic components (145) from a canister (150) includes filling the canister (150) with pressurized gas, dispensing components (145) mounted on a component carrier (140) through an opening (154) within the canister (150), conforming the opening (154) to the components (145) and to the component carrier (140) as the components (145) are dispensed, and maintaining sufficient gas pressure within the canister (150) to prevent air from entering into the canister (150). The canister (150) has an inlet (158) for receiving a gas and a seal (156) disposed about the opening (154) to reduce the amount of gas loss through the opening (154) when the components (145) are dispensed.

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Libertyville, IL, United States of America

Kiron P Gore