Ut-battelle, Inc.

Columbia Insurance Company

Kirk T Lowe

Gregory D Fowler

Curtis W Ayers

Benny R Wood

Robert J Miller

Andrew A Wereszczak

Randy H Wiles

The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Direct cooled power electronics substrate

The invention provides a new floor covering panel and floor covering system in which the floor covering panels include first and second generally planar surfaces, first and second side edges containing first and second complementary coupling members, respectively, and an adhesive composition selectively applied to at least a portion of at least one of the first and second coupling members. The adhesive composition providing the adhesive bond may be applied to at least one of the first or second coupling members during the floor covering manufacturing process. After a floor covering system is assembled, the adhesive composition provides a substantially non-refastenable bond between mated floor covering panels.

Pre-glued tongue and groove flooring

Growing community of inventors

Knoxville, TN, United States of America

Kirk T Lowe