Tpl, Inc.

Halliburton Energy Services, Inc.

Chevron U.s.a. Inc.

Lawrence Livermore National Security, LLC

Sdg LLC

Kirk M Slenes

William Francis Hartman

Kristen J Law

Stephen E Sampayan

William M Moeny

David M Sanders

H M Stoller

A downhole drilling system is disclosed. The downhole drilling system may include a drill bit including a first electrode and a second electrode. The downhole drilling system may also include a pulse-generating circuit coupled to the first electrode and the second electrode. A capacitor within the pulse-generating circuit may include a plurality of electrode sheets and a plurality of dielectric sheets interleaved with the plurality of electrode sheets. Each of the dielectric sheets may include a composite material including a polymer matrix formed from a polymer component and a nanoparticle component that increases the dielectric constant of the composite material above that of the polymer component.

High-power capacitor for downhole electrocrushing drilling

A linear accelerator having cast dielectric composite layers integrally formed with conductor electrodes in a solventless fabrication process, with the cast dielectric composite preferably having a nanoparticle filler in an organic polymer such as a thermosetting resin. By incorporating this cast dielectric composite the dielectric constant of critical insulating layers of the transmission lines of the accelerator are increased while simultaneously maintaining high dielectric strengths for the accelerator.

Cast dielectric composite linear accelerator

A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Integral capacitance for printed circuit board using dielectric nanopowders

A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a T greater than 140&deg; C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from &minus;55 to 125&deg; C.

Dielectric material including particulate filler

Polymer/paper capacitor film

Growing community of inventors

Albuquerque, NM, United States of America

Kirk M Slenes