Applied Materials, Inc.

Twin Creeks Technology, Inc.

Kirk G Liebscher

Steven M Zuniga

Derek G Aqui

John M Alexander

Andrew J Nagengast

Robert D Tolles

Virendra V S Rana

Venkateswaran Subbaraman

Keenan Leon Guerrero

Zhenhua Zhang

In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve. Typically, the valve is then closed and the transferred batch can be delivered to a polishing pad through the dispense nozzle fluidly coupled to the second chamber, often by pressurizing the second chamber using pressurized gas delivered thereinto through the second delivery line.

Small batch polishing fluid delivery for CMP

A system for treating distinct batches of workpieces to serial procedures comprises first and second multi-site structures. In each multi-site structure the sites are rotatable for alignment in turn with loading and unloading stations together constituting treatment or process stations. Workpieces of a batch are loaded onto all of the treatment sites and then simultaneously and identically treated by operation of treatment stations with which the process sites are aligned. After treatment in the first structure, workpieces of a batch are transferred from the unloading stations of the first structure to the loading stations of the second structure for further processing.

Two-chamber system and method for serial bonding and exfoliation of multiple workpieces

An apparatus and method for processing the solar cell substrates is provided. In one embodiment, a laser firing chamber for processing solar cell substrates placed in a carrier, comprising a laser module located at a side of the carrier, the laser module being adapted to generate and direct multiple laser beams over an entire surface of a plurality of solar cell substrates, and a transport adapted to convey the carrier through an outputting region of the laser beams.

Laser system for processing solar wafers in a carrier

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San Jose, CA, United States of America

Kirk G Liebscher