Hewlett-packard Development Company, L.p.

Hewlett-packard Development, L.p.

Kirby Sand

Charles Craig Haluzak

Chien-Hua Chen

John R Sterner

Jeffrey R Pollard

Michael John Regan

Kenneth James Faase

Bao-Sung Bruce Yeh

James Denning Smith

Bradley Bower

Henry Kang

Paul Felice Reboa, Jr

Quan Qi

One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.

Wafer bonding method

One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.

Microelectronic device

A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.

Microfluidic device and a fluid ejection device incorporating the same

A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.

Method for forming a fluid ejection device

A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet.

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Packaged MEMS device assembly

A method for providing an anti-stiction coating on a metal surface includes reacting a vapor of perfluorooctylhydroxamic acid with the metal surface in a reaction chamber.

Method for providing an anti-stiction coating on a metal surface

In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.

Bonding interface for micro-device packaging

A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.

Micro-displays and their manufacture

A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.

Growing community of inventors

Corvallis, OR, United States of America

Kirby Sand