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Kirby H Spalding

Stanley M Chang

Patrick Weiher

Robert M Fujioka

An electrical connector semiconductor package with electrically conductive 'fly-over' paths wherein semiconductor package hermetically seals one or more substrate comprising one or more semiconductor devices, such as active or passive ICs, and other semiconductor components. Semiconductor package with 'fly-over' paths comprises a first package face comprising a first set of connector terminations, such as a set of connector pins that receive a set of incoming external signal. Semiconductor package with &#x201c;fly-over&#x201d; paths also comprises a second package face comprising a second set of connector termination, wherein the second set of connector terminations might comprise a set of connector pin cusps to couple to an external board or another connector. One or more of the first set of connector terminations are provided to couple a set of incoming external signals to the one or more semiconductor devices on a substrate via a set of signal pins.

Electrical connector semiconductor package with fly-over signal paths

An integrated electrical connector with one or more semiconductor dice coupled to a plurality of signal blades provided in accordance with the principles of this invention. Incoming signals are processed by one or more semiconductor dice for applications such as reducing transmission line effect attributable to noise, cross-talk, signal attenuation, and other signal degradation effects before being re-transmitted as reconditioned outgoing signals as a set of corresponding output signals from the integrated connector via a plurality of signal and shield blades. Providing one or more semiconductor dice in the connector allows degradation from high-speeds transmission line paths along a printed circuit be segmented and corrected at the site of these integrated electrical connectors before being retransmitted to the next circuit board or device along the signal path.

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San Jose, CA, United States of America

Kirby H Spalding