Apple Inc.

Kiran S Pillai

Sameer Pandya

Erik G De Jong

Daniel J Barrett

Xuan Liu

Daniel William Jarvis

Paul Choiniere

David Andrew Doyle

Jia Liu

Jingjing Xu

Elizabeth C Porter

James P Landry

Dakota A Bass

Adam J Brinkman

Shang L Tsuei

Jacquelynn M Pok

Kyle M Zampaglione

Tsung-Ting Tsai

Jean-Pierre Simon Guillou

Weijun Yao

Tyler Robin Kakuda

Michael J Brown

Mario Martinis

Injae Hwang

Yi Qiao

Yifan Zhang

Jiayi Jin

Chuang Qian

Tae-Wook Koh

Hao Dong

Maofeng Yang

Yongjun Li

Mathew K Mathai

Di Liu

Jiye Lee

An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.

Electronic devices with molded display mounting structures

An electronic device may include a display, a cover layer overlapping the display, and a housing have housing sidewalls. An encapsulant material may surround at least part of the display and may be used to couple the cover layer to the housing sidewalls. A rigid outer material having a higher elastic modulus than the encapsulant material may also be used to couple the cover layer to the housing sidewalls. The rigid outer material may be a molded material that surrounds an outer perimeter of the encapsulant, or the rigid outer material may be a metal or plastic frame member having a C-shaped cross-section or other geometry. The display may overlap the housing sidewall. The encapsulant may absorb mechanical stresses on the cover layer to protect the display, whereas the rigid outer material may transfer mechanical stresses on the cover layer to the housing.

Electronic devices with display support structures

A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.

Electronic device

A display assembly for an electronic device can include a printed circuit board, a display panel, and a support structure affixed to the display panel and disposed between the display panel and the printed circuit board.

An electronic device may include an electronic display including display pixels to display an image based on compensated image data. The electronic display may also include a stressed reference pixel to exhibit burn-in related aging in response to one or more stress sessions and a non-stressed reference pixel configured to not undergo the one or more stress sessions. Additionally, the electronic device may include image processing circuitry to determine a panel-specific aging profile based on a comparison between one or more properties of the stressed reference pixel and the one or more properties of the non-stressed reference pixel. The image processing circuitry may also generate one or more gain maps based on the panel-specific aging profile and generate the compensated image data by applying the one or more gain maps to input image data.

Reference pixel stressing for burn-in compensation systems and methods

Growing community of inventors

San Bruno, CA, United States of America

Kiran S Pillai