Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Yamaichi Electronics Co., Ltd.

Apresia Systems, Ltd.

Kinya Yamazaki

Yoshinori Sunaga

Yoshiaki Ishigami

Hidetaka Kawauchi

Masataka Sato

Juhyun Yu

Hidenori Yonezawa

Shinji Komatsuzaki

Hiroki Katayama

Akira Ogura

Tenpei Inoue

Hiroki Yasuda

Norio Chujo

Koki Hirano

Izumi Fukasaku

Toshiyasu Ito

Naoki Matsushima

Yosuke Takai

Yasunobu Matsuoka

Hideo Arimoto

Akihiro Hiruta

Toshiaki Takai

Kazuo Ishiyama

Takehiko Tokoro

An optical communication module includes a module board housed in a casing, a VCSEL and a driving IC mounted on a mounting surface of the module board, a lens holder mounted on the mounting surface of the module board, a lens block held by the lens holder, a plurality of thermal vias passing through the module board, and a first fixing screw and a second fixing screw passing through the module board to be screwed into the casing so as to press a back surface of the module board against a bottom surface of the casing, and the first fixing screw and the second fixing screw are each arranged in a region between the plug connector and the lens holder and on either outer side of the lens holder.

Optical communication module

In a transceiver module, where one end of a module substrate is inserted and connected to a concave portion of a plug connector and when one end face of the module substrate is touched to the inner periphery face forming the concave portion, a projection portion formed at the periphery of the concave portion of the plug connector is fitted to a notch portion of the module substrate.

Transceiver module plug connector

A transmission module includes an electrically insulative substrate body, a first card edge connector provided at a first end of the substrate body, a second card edge connector provided at a second end of the substrate body, a circuit element mounted on the substrate body, a control element mounted on the substrate body and provided with a built-in memory which controls the circuit element, a first wiring pattern formed on the substrate body for connecting an electrode of the first card edge connector and the control element together, and a second wiring pattern formed on the substrate body for connecting an electrode of the second card edge connector and the control element together.

Transmission module and circuit board used therein

A communication module is further miniaturized to achieve an improvement in the mounting density of the communication module. A communication module includes a plug connector connected to a receptacle connector, and the plug connector has an insertion projection inserted into an insertion recess provided on the receptacle connector. The insertion projection has a board insertion portion into which an insertion end portion of a module board incorporated in the communication module is inserted formed therein, the insertion end portion is inserted into the board insertion portion, and first electrodes formed on the plug connector are electrically connected to the module board.

Communication module and communication module connector

A connector is configured of a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: a first sidewall portion and a second sidewall portion that are in parallel with each other and a plurality of first connection terminals provided on the sidewall portions. The receptacle connector has an insertion concave portion to which the insertion convex portion is inserted and in which a plurality of second connection terminals that are contacted with the first connection terminals are provided. The respective inner side surfaces of the first sidewall portion and the second sidewall portion face each other across a space, and the plurality of first connection terminals are arranged on the respective outer side surfaces of the first sidewall portion and the second sidewall portion.

The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.

Optical module assembly, optical wiring board, and information processing device using them

An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface of the second member and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls of the first member. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

Optical transmission module

A connector includes a plug connector and a receptacle connector. The plug connector has an insertion convex portion including: an end surface; outer side surfaces facing in parallel to each other across the end surface; and a first tapered surface connecting each outer side surface and the end surface. The receptacle connector has an insertion concave portion including: an insertion port; inner side surfaces facing in parallel to each other across the insertion port; and a second tapered surface connecting each inner side surface and an edge of the insertion port. The outer side surfaces of the insertion convex portion have first connection terminals arranged, the inner side surfaces of the insertion concave portion have second connection terminals arranged in contact with the first contact terminals, and the first tapered surface has a width twice as large as a width of the second tapered surface or larger.

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

Optical module

An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a connector member attachable to and detachable from the second member, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

To suppress degradation of signals exchanged between the semiconductor chip and each of the communication modules while a large number of communication modules are mounted near a semiconductor chip at a high density. A connector includes a plug connector provided in a communication module and a receptacle connector provided in a motherboard to which the connection module is connected. The plug connector has an inserting convex portion that is connected to a module substrate included in the communication module. The receptacle connector has an inserting concave portion into which the inserting convex portion is inserted. A plurality of first connection terminals are arranged in two outer side surfaces in parallel with each other, of the inserting convex portion. A plurality of second connection terminals in contact with the first connection terminals are arranged in two inner side surfaces in parallel with each other, of the inserting concave portion. A thickness of the module substrate is one half or less of a thickness of the inserting convex portion.

An optical communication module is composed of a photoelectric conversion element to transduce an optical signal into an electrical signal or an electrical signal into an optical signal, an optical fiber including an end and being optically coupled to the photoelectric conversion element, a receiving member including an outer surface and receiving the end of the optical fiber and the photoelectric conversion element, and a plurality of electrodes protruded from the outer surface of the receiving member and aligned in a straight line. The optical fiber is drawn from the outer surface of the receiving member and in an oblique direction relative to a direction of the alignment of the plurality of electrodes.

Optical communication module and optical communication device

A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.

Communication module-cooling structure and communication device

Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Growing community of inventors

Hitachi, Japan

Kinya Yamazaki