Ibiden Company Limited

Kinya Ohshima

Mitsuhiro Kondo

Atsushi Hiroi

Takuji Asai

An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards and the latter being integral with the frame.

Electronic-parts mounting board and electronic-parts mounting board frame

An electronic-parts mounting board frame sheet includes a plurality of electronic-parts mounting board frames serially coupled into a single sheet. Each frame includes an electronic-parts mounting board with an insulating substrate, grouped leads protruding from the insulating substrate, an outer frame integrally formed with the grouped leads, and pilot holes, located in the outer frame, for indicating the positions of the grouped leads of the electronic-parts mounting board. Further, the grouped leads and the outer frame of each electronic-parts mounting board frame are integrally formed.

A method for mounting an electronic component comprising providing an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner ends of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

Method of manufacturing a high lead count circuit board

A circuit board for mounting an electronic component comprises an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner end of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

Growing community of inventors

Oogaki, Japan

Kinya Ohshima