Fujitsu Corporation

Kinuko Mishiro

Toru Okada

Yutaka Higashiguchi

Yoshikazu Hirano

Masahiko Yamashita

A substrate on which an electronic component is soldered, includes an electronic component, a through hole positioned on the substrate and passing through the substrate, a solder that joins the through hole and a terminal of the electronic component inserted in the through hole, a pattern formed on a first surface of the substrate, the first surface facing a second surface on which the electronic component is placed, a first resist superimposed on the pattern, an exposed portion of which the pattern is exposed from the first resist around the through hole, and a second resist superimposed on the pattern and arranged between the through hole and the exposed portion.

Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

Method of making assembly module and board module and electronic apparatus

To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.

Component mounting substrate and structure

A method of manufacturing a connecting structure of first and second printed wiring boards each having an electrode for conductively connecting to each other using a conductive film. A first printed wiring board with a resist film bonds to a second printed wiring board directly or using conductive film or bonding film. Both electrodes can be bonded using a conductive film and/or a bonding film. The resist film on one printed wiring board can be bonded to the electrode of another printed wiring board using a conductive film, or both resist films can be bonded using a conductive film.

Growing community of inventors

Kawasaki, Japan

Kinuko Mishiro