Toyo Kohan Co., Ltd.

Other

Toyo Kohan., Ltd.

Kinji Saijo

Kazuo Yoshida

Shinji Ohsawa

Yoshihiko Isobe

Hiroaki Okamoto

Nobuyuki Yoshimoto

Akiyoshi Takada

Hiroaki Kawamura

Yoshiyuki Sugimoto

Mitsuhiro Watanabe

Tadatomo Suga

Tsuneo Inui

Yoshikazu Kondo

Taizo Sato

Nobuyoshi Shimizu

Akira Ikeda

Akira Takagi

Kenji Hizuka

Tsutomu Seki

Giichiro Nomura

Keiji Ariga

Sinji Ohsawa

Shingji Ohsawa

Hiromasa Suzuki

Koji Nanbu

Tsukasa Fujimura

Takuo Ando

A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.

Printed wiring board and method for manufacturing printed wiring board

A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.

Multilayer printed wiring board and method of manufacturing the same

A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

Semiconductor device and fabrication method therefor

An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Multilayered metal laminate and process for producing the same

A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

Gas separating unit and method for manufacturing the same

A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials () forming conductive layers () and nickel plating () forming etching stopper layers () are formed and pressed to form a clad plate () for forming an interposer for a semiconductor device. Thus, a clad plate () for forming an interposer for a semiconductor device is manufactured. The clad plate () is selectively etched to form a columnar conductor (), and an insulating layer () is formed on the copper foil material forming a wiring layer (). A bump () for connection of a semiconductor chip and the wiring layer () are formed on the opposite side to the side on which the columnar conductor () is formed. Thus, an interposer for a semiconductor device is manufactured.

Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them

A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. () A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring. () A semiconductor device which comprises a multilayer metal foil for fabricating wiring in place of the metal foil for forming wiring of the semiconductor device described in (); and a method of fabricating conductor wiring having a bump on a semiconductor, comprising the steps of the method described in () and further comprising the steps of forming a resist pattern for forming the bump by photo-etching the multilayer metal foil for forming the wiring, forming a bump by selective etching, and removing an etch-stop layer.

Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit

A method of forming a protective coating on a cell safety valve element by coating the cell safety valve element with a protective film to protect metal portions thereof against corrosion, a cell safety valve element coated with a protective film, a cell sealing plate using the element, and an enclosed cell using the plate. The safety valve element comprises a coating ( ) obtained by applying an organic paint onto at least one surface of the cell safety valve element ( ) consisting of a metal base plate ( ) having a through hole ( ) drilled therein and a metal foil ( ) laminated on the metal base plate ( ) so as to block the through hole ( ). The sealing plate is formed by bringing the cell safety valve element ( ), on which a protective coating ( ) comprising an organic resin film is formed, into contact with a cell exterior can sealing plate ( ), in which the through hole ( ) acting as a safety valve port is drilled so that the through hole ( ) in the metal base plate of the cell safety valve element ( ) and the through hole ( ) in the sealing plate face each other and bonding the both at a portion around the through hole ( ) in the sealing plate to form the cell sealing plate. The enclosed cell is formed by fitting and supporting the cell sealing plate at the inner periphery of an opening of the cell exterior can in which are housed an electrode body consisting of a positive electrode, a negative electrode and a separator together with an electrolyte to block the opening in the cell exterior can.

Method of forming protective coating on cell safety valve element, cell safety valve element coated with protective film, cell sealing plate using the element, and enclosed cell using the plate

A closed battery which is capable of rapidly releasing the internal pressure there while simultaneously disconnecting the current to prevent the internal temperature of the battery from rising and causing the battery to explode. Thus, when the internal pressure of the closed battery is elevated due to a short circuit, overcharge, reverse charge, or the like, internal gas in the battery can be safely discharged and the battery prevented from bursting.

Closed battery

Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof

A method of manufacturing a high-quality metal foil/ceramics joining material ( ) and a metal foil laminated ceramic substrate ( ) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material ( ) can be prevented from being broken because the ceramics material ( ) is heated while being placed on a holder ( ) and is pressure-joined under a pressure of 1 kg/mm or lower.

Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate

The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad sheet for lead frame is manufactured by press-bonding copper foil to nickel foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding copper foil having nickel plating on one or both sides of it to the other copper foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding aluminum foil to nickel foil at the reduction rate of 0.1 to 3%. Further, it is also manufactured by press-bonding copper foil having nickel plating on one side of it to aluminum foil at the reduction rate of 0.1 to 3%. Clad sheet is comprising three layer of copper/nickel/copper or copper/nickel/aluminum.

Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame

Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof

A completely-enclosed cell wherein if the internal pressure in the cell rises because of short circuit or overcharging, temperature rise and explosion of the cell is effectively prevented, the current is cut off, and the internal pressure is simultaneously and quickly released. The cell includes a sealer comprising a valve body composed of a metal substrate perforated at narrowly spaced intervals in the endless periphery and a metal foil substrate to cover the perforations. The cell a structure in which a narrow gap portion of a 98 metal plate deformable even by a weak force of when the internal pressure increases elongates and the portion surrounded by the through holes projects

Growing community of inventors

Yamaguchi-ken, Japan

Kinji Saijo