Shinko Electric Industries Co., Ltd.

Kinji Nagata

Junichi Nakamura

Masao Nakazawa

Kei Imafuji

Tadashi Kodaira

Masaru Yamazaki

Masaki Sanada

Sachiko Oda

Kenjiro Enoki

A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Solder bump forming method

A multilayered wiring substrate is constructed by stacking wiring layersand insulating layersin predetermined number, with at least one of the wiring layers being formed as a reinforcing wiring layerwhose thickness is 35 to 150 &#x3bc;m arranged in one layer or plural layers. Also, the thickness of the reinforcing wiring layer is larger than that of the other wiring layers.

Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same

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Nagano, Japan

Kinji Nagata