Sandisk Information Technology (shanghai) Co., Ltd.

Sandisk Semiconductor (shanghai) Co. Ltd.

Sandisk Technologies Inc.

Sandisk Corporation

King Hoo Ong

Li Ping Wang

Ning Ye

Weili Wang

Kim Lee Bock

Enyong Tai

Hem P Takiar

Chin-Tien Chiu

Jianhua Wang

Cheeman Yu

Suresh Kumar Upadhyayula

Zhong Lu

Jack Chang Chien

JinXiang Huang

Peng Fu

Yuang Zhang

Pradeep Rai

Shicai Ma

Robertito Piaduche

Pradeep Kumar Rai

XingZhi Liang

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Non-uniform vacuum profile die attach tip

A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

System for separating a diced semiconductor die from a die attach tape

A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die&#x2014;forming a new package. The new package is encapsulated to form a new memory card.

Method for reclaiming semiconductor package

Growing community of inventors

Shanghai, China

King Hoo Ong