Pulse Finland Oy

Kimmo Honkanen

Kimmo Koskiniemi

Petteri Annamaa

Jouni Liflander

Directional antenna apparatus and methods of utilizing the same. In one embodiment, the directional antenna apparatus includes a chip component disposed on a ground plane. The chip component includes a conductive layer disposed upon a ceramic substrate. The conductive layer of the chip component is connected to electronic circuitry via one or more feed structures and one or more ground structures. The chip component and the ground plane are disposed atop a reflector component in a substantially orthogonal orientation. By spacing the ground plane from the reflector component by a set amount, the directional nature of the directional antenna apparatus may be configured.

Directional antenna apparatus and methods

Apparatus and methods for enhanced antenna port isolation are disclosed. In one embodiment, a spatially compact patch antenna apparatus is disclosed. A plurality of walls are incorporated into the antenna assembly's bottom cover. The walls are located under the radiating element located on a top cover of the antenna assembly. The walls are in one implementation oriented orthogonally with respect to one another, and are placed adjacent to respective antenna feeds. The walls are then at least partly metallized using, for example, a laser direct structuring (LDS) process, and are further connected to a ground plane of an external substrate. By incorporating the metallized wall structures on the existing plastic structure of the bottom cover, isolation between the antenna ports is improved without requiring installation of additional components, use of slots in the ground plane, or increased physical separation (i.e., distance). Manufacturing cost and consistency are also advantageously improved.

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Oulu, Finland

Kimmo Honkanen