Adeia Semiconductor Bonding Technologies Inc.

Tessera Interconnect Materials, Inc.

Nippon Telegraph and Telephone Corporation

North Corporation

Kimitaka Endo

Belgacem Haba

Yoichi Kubota

Chang Myung Ryu

Tetsuya Yamamoto

Norihito Masuda

Tomoo Iijima

Sean Moran

Takashi Imaeda

Tsutomu Yabuuchi

Jinsu Kwon

Ken-ichiro Shimokura

Tomokazu Shimada

Jouji Nakayama

Vage Oganesian

Hirohisa Tezuka

Masato Urano

Ken-Ichiro Shimokura

An interconnect elementcan include a dielectric layerhaving a top faceand a bottom faceremote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces. A plurality of conductive protrusionscan extend upwardly from the plane defined by the first metal layerthrough the dielectric layer. The conductive protrusionscan have top surfacesat a first heightabove the first metal layerwhich may be more than 50% of a height of the dielectric layer. A plurality of conductive viascan extend from the top surfacesof the protrusionsto connect the protrusionswith the second metal layer.

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Microelectronic interconnect element with decreased conductor spacing

An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

Interconnection element with posts formed by plating

Method of making a microelectronic interconnect element with decreased conductor spacing

A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

Method of fabricating an interconnection element having conductive posts

An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.

Interconnection element for electric circuits

A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming at least one opening extending through a bump-forming die body in the thickness direction thereof and positioning a bump-forming die lid on a surface of the bump-forming die body so as to cover one end of the opening and to thereby define a bump-forming recess. The bump-forming die body may be comprised of a metal sheet. A metal layer is formed at least on an inner surface of the bump-forming die lid exposed within the bump-forming recess. The mandrel is removed so as to expose the metal layer and form a bump structure.

Bump structure formed from using removable mandrel

An interconnect element is provided which includes a dielectric element having a first major surface, a second major surface remote from the first major surface, and a plurality of recesses extending inwardly from the first major surface. A plurality of metal traces are embedded in the plurality of recesses, the metal traces having outer surfaces substantially co-planar with the first major surface and inner surfaces remote from the outer surfaces. A plurality of posts extend from the inner surfaces of the plurality of metal traces through the dielectric element, the plurality of posts having tops exposed at the second major surface. A multilayer wiring board including a plurality of such interconnect elements is also provided, as well as various methods for making such interconnect elements and multilayer wiring boards.

A system management method is disclosed for associating a process object and a process with each node in a tree structure, and operating each node based on the tree structure so as to manage the process object and the process, including: registering a registered user that performs operations for a general node corresponding to the process object or for a function node corresponding to the process; setting the function node as a child node of the general node corresponding to the process object for which the process corresponding to the function node should be performed, and setting the general node as a parent node of the function node; setting registered user operation authority for each registered user; and, when execution of the process corresponding to the function node is requested by the registered user, causing the function node to execute the process only when the process is permitted by the registered user operation authority, of the registered user requesting the process, set in the general node that is a parent node of the function node.

System management method, system management device, system management program, and storage medium containing system management program

A database access control apparatus generates and stores an access key based on a user ID of a user apparatus. Then, the database access control apparatus sends the access key to the user apparatus with an address of a proxy process server apparatus. The user apparatus sends the access key to the proxy process server apparatus when making a database access request, and the proxy process server apparatus sends the access key to the database access control apparatus when making a database process request. When receiving the database process request, the database access control apparatus determines whether an access key same as the access key received from the proxy process server apparatus is stored in the database access control apparatus, and accesses the database only if having the access key.

Database access control method, database access controller, agent processing server, database access control program, and medium recording the program

A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

Growing community of inventors

Tokyo, Japan

Kimitaka Endo