Hitachi, Ltd.

Hitachi Koki Co., Ltd.

U.S. Philips Corporation

Hitachi Metals, Ltd.

Opnext Japan, Inc.

Other

Nichia Corporation

Hiatchi, Ltd.

Hitachi, Litd.

Kimio Tatsuno

Keiji Kataoka

Toshinori Hirataka

Koji Yoshida

Susumu Saito

Akira Arimoto

Kazuyuki Fukuda

Takeshi Shimano

Takeshi Kato

Yoshito Tsunoda

Toshiaki Ishii

Tsutomu Kono

Tadaaki Ishikawa

Toshimasa Miura

Hiroaki Furuichi

Hirohisa Sano

Kouji Yoshida

Katsumi Kuroguchi

Takeshi Maeda

Shigeru Nakamura

Hisataka Sugiyama

Seiji Yonezawa

Kazumi Kawamoto

Masahiko Takahashi

Hiroshi Naka

Masato Shishikura

Masahide Tokuda

Toshimitsu Miyauchi

Yoshifumi Homma

Takeshil Kato

Kazuo Shigematsu

Masahiro Ojima

Tetsuo Andou

Shigeharu Kimura

Carolus J Van Der Poel

Osamu Komoda

Shoichi Takahashi

Satoru Kikuchi

Shoichi Ito

Atsuhiro Yamamoto

Norihiro Yazaki

Sten Helmfrid

Yoshifumi Ono

Motoyasu Terao

Toshiaki Tanaka

Hiroshi Fukuda

Kenchi Ito

Tsuyoshi Toda

Fumiyoshi Kirino

Tatemi Ido

Masataka Shirai

Isamu Terashima

Shinji Tsuji

Masatoshi Ohtake

Norio Nakazato

Hiroaki Inoue

Fumio Kugiya

Kunio Aiki

Ronald Reindert Drenten

Kouichirou Wakabayashi

Masayoshi Sato

Hideyuki Kuwano

Misuzu Sagawa

Akira Hashimoto

Fumiyuki Inose

Kohei Ito

Junji Shigeta

Naohiko Baba

Fumio Nitanda

Keizo Kato

Tsuyoshi Miyai

Gerard A Acket

Ryoichi Ito

Mitsugu Asano

Yasunori Iwafuji

Yasutsugu Takeda

Koji Muraoka

Hisao Kurosawa

Jan Opschoor

Norio Murase

Teruhisa Azumaguchi

Hiroshi Momiji

Hironori Yanagisawa

Michael McLoughlin

Yoichi Yasuda

Fumio Imagawa

Jinichi Hongou

An integrated optical head records and reproduces information to and from optical discs of different types, including CD and DVD, with use of a single information recording/reproducing apparatus. The optical head has a plurality of semiconductor lasers of different wavelengths integrated by index alignment onto a substrate formed with an optoelectric integrated circuit, photodetection patterns, and a reflecting mirror.

Optical head with lasers and mirrors in a recess formed in a substrate

An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Optical module, method for manufacturing optical module and optical communication apparatus

An object of disclosed technology is to control lasing wavelengths so that a wavelength shift does not occurs. Another object is to permit wavelengths of a light source for wavelength division multiplexing optical-fiber communication system to be variable in response to an ITU-TS grid. A means for achieving the objects is as follows: locating an etalon in a light path of diode laser light, which is a parallel plane wave changed by a collimator lens; generating a wavelength error signal from a difference between both of divided pieces of light from transmitted light or reflected light; and locking a wavelength of a diode laser device according to the wavelength error signal.

Optical fiber communication equipment and its applied optical systems

A laser diode module includes a laser diode device, a first photo detector part for receiving, first divided light that is a first portion of light when at least one of light emissions of the laser diode device is divided into two portions of light each traveling a different optical path, a second photo detector part for receiving second divided light that is a second portion of light thus divided via at least a wavelength selective member, and a controller which controls the lasing wavelength of the laser diode device on the basis of outputs of the first and second photo detector parts. A beam splitter provided between the laser diode and the wavelength selective member divides light emitted from the laser diode into the first and second divided light and a quarter-wave plate is provided in an optical path between the beam splitter and the wavelength selective member.

Laser diode module

A method of mounting an optical device having a step on the surface opposing to a mounting substrate favorably by face-down bonding which enables a decrease in the number of components or integrate additional components on one identical substrate and, accordingly, is useful for reducing the size and the thickness of an optical head using a light source, the method includes the step of making the volume of a solder pattern to the area ratio of each electrode different for every wiring electrode portions upon mounting the electrodes on the substrate for mounting the optical device, in which the optical device having the step can be mounted favorably to the substrate by the control for the height of solder upon melting.

Mounting method for optical device and optical head equipment

A subject of the invention is to reduce the temperature dependence of an etalon as a wavelength locker for a semiconductor laser device and so forth. Concretely, it is to restrict the lowering of the wavelength locking performance of the etalon dependent on the temperature variation. A means to solve the subject is the use of an air gap etalon. Concretely, the means is provided with a media plate and parallel plane plates on both sides of the media plate. The two parallel plane plates and the space between them constitute the air gap etalon.

Optical transmitter modules

Conventionally, in the wavelength locking optical system, the wavelength as detected is deviated from a targeted range owing to the change of the peripheral temperature resulting from the temperature characteristics of the wavelength error detection device. To solve this prior issue, it is arranged such that a portion of the wavelength error detection device, through which portion light-beams passes, contacts a material of high heat conductivity.

Diode laser controling module and applied equipment thereof

This invention is provided to reduce wavefront aberrations caused by the filling of a transparent resin intended to prevent degradation of a diode laser in a hermetically sealed package. A parallel-plane plate is arranged between a diode laser and an objective lens, and a transparent resin is filled into a space formed between the diode laser and the parallel-plane plate. With this invention, degradations of the diode lasers can be prevented and the wavefront aberrations can be reduced.

Diode laser module and application equipment

An optical communication equipment includes a semiconductor laser element, an image-forming element, an optical fiber and a substrate for mounting the semiconductor laser element, the image-forming element and the optical fiber. An optical output of the semiconductor laser element is adapted to be provided to the optical fiber via the image-forming element. The image-forming element is mounted in a V-groove formed in the substrate and having a substantially &ldquo;V&rdquo;-shaped cross-section. A shortest distance between a light spot of the semiconductor laser element and an optical axis of the image-forming element is 1 mm at most and the image-forming element substantially satisfies the sine condition.

Optical communication equipment and optical communication network equipment

To resolve a problem in which in an optical output and wavelength monitor integrated type semiconductor laser module monolithically integrated in parallel with a plurality of semiconductor lasers, since light emitting positions of the respective semiconductor lasers differ, an allowable range of an optical incident position of the monitor is exceeded, the optical incident position of the monitor is confined in the allowable range by integrating backward optical waveguides for guiding backward beam of the respective semiconductor lasers to a narrow range at a backward end of a semiconductor chip along with the semiconductor lasers, whereby there can be easily realized a semiconductor laser module with a built-in optical monitor even in the case of the chip integrated with the plurality of semiconductor lasers and can be realized an inexpensive optical module having high function.

Optical integrated device, semiconductor laser module and optical transmitter

Module for optical communication

In a wavelength locking optical system, a resonator is formed between a wavelength deviation detection device and a facet of the laser diode, which makes a control signal unstable. A solution to this problem is to arrange polarization controlling elements between a wavelength deviation detection filter and a laser diode to stabilize the deviation signal, and to perform wavelength-locking with the stabilizer signal.

A conventional problem is to provide an optical module capable of being reflow mounted together with electronic components collectively, and, at the same time, securing a mechanical strength that can bear a large stress at the time of an attachment/detachment of the optical fiber. A solution to the above-mentioned problem can be attained by using an optical connector removable type optical module for reflow mounting having a fixing structure for fixing itself to a mount board, including a receptacle part installed to an optical module to which an optical connector is detachably connected; electric terminals for reflow mounting that are arranged corresponding to lands on a mount board ; and stud parts that are able to fit in fixing holes on the mount board

Optical module, board mounted optical module, and assembly method of optical module

An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Growing community of inventors

Tokyo, Japan

Kimio Tatsuno