Hitachi, Ltd.

Hitachi Tokyo Electronics Co., Ltd.

Kimio Muramatsu

Masao Sakata

Seiji Ishikawa

Yuzo Taniguchi

Sadao Shimoyashiro

Isao Miyazaki

Kazuhiko Matsuoka

Hiroto Nagatomo

Jun Nakazato

Yuichi Ohyama

Tsutomu Okabe

Yuzaburo Sakamoto

Shuichi Hanashima

Osamu Satou

Taizo Hashimoto

Yutaka Ebara

Takashi Nagaoka

Masahiro Mase

Ichiro Gyobu

Shinjiroo Ueda

Shigeo Tomiyama

Tadao Kusaka

Akihiko Satou

Hiroaki Sakamoto

Kouzi Aoki

Akira Nishiuchi

Yoshihisa Awada

Keiji Ueyama

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Inspection data analyzing system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Inspection system and method using separate processors for processing different information regarding a workpiece such as an electronic device

This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

Vacuum system with a secondary gas also connected to the roughing pump

A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.

Vacuum pump

This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

Method for LPCVD of semiconductors using oil free vacuum pumps

Growing community of inventors

Takasaki, Japan

Kimio Muramatsu