Mitsubishi Denki Kabushiki Kaisha

Kimio Hashizume

Kenji Kubozono

Takefumi Itou

Shinichi Iwase

Tetsuya Watanabe

Takashi Nakajima

Hiroyuki Teramoto

Hideya Ito

Teruo Nakanishi

Keizo Kitakaze

Takashi Nakagima

A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities. The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.

Copper Ni-Si-P alloy for an electronic device

A method for manufacturing a shadow mask is used for color television picture tubes and the like. The surface of a shadow mask body, made of Fe-Ni type alloy, is ion-nitriding processed so as to make the most of the low thermal expansion property inherent in the alloy. The result is that the color purity degradation caused by the thermal expansion at temperature increases of the mask, and by the resonance of the mask itself, can be prevented, thereby realizing a shadow mask serving to render a highly refined CRT.

Method for manufacturing a shadow mask

An improved method for producing a copper alloy, wherein a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, and a remainder of Cu and unavoidable impurities (or a molten metal consisting essentially of 1.0 to 8% by weight of Ni, 0.1 to 0.8% by weight of P, 0.06 to 1.0% by weight of Si, 0.03 to 0.5% by weight of Zn, and a remainder of Cu and unavoidable impurities) is quenched to solidify, at a cooling rate in the range from 10.sup.2 .degree. C./sec. to 10.sup.5 .degree. C./sec., and continuously cooling in succession said solidified metal to a normal temperature, to cause an intermetallic compound of Ni-P and Ni-Si to be finely and uniformly dispersed into the matrix material.

Process for producing copper alloy

A Cu-Ni-Sn alloy with excellent fatigue properties comprising 6 to 25 wt % of Ni, 4 to 9 wt % of Sn, 0.04 to 5 wt % in total of at least one element selected from the following elements:

Cu-Ni-Sn alloy with excellent fatigue properties

A copper alloy for an electronic device comprises 1.0 wt %-4.0 wt % of Ni, more than 0.2 wt % and less than 0.8 wt % of P, 0.5 wt %-6.0 wt % of Zn and the rest being copper and unavoidable impurities. The rest may include 0.05 wt %-1.0 wt % of Mg. A wire of the above-mentioned copper alloy is prepared by heating the copper alloy having the composition described above at temperature of 750.degree. C.-950.degree. C. for more than one minute before the final rolling operation, and then, heating the material at a temperature of 350.degree. C.-500.degree. C., or slowly cooling it at a rate of 4.degree. C./min. or less, or cooling it at a rate of 1.degree. C./min. or more until temperature reaches 500.degree. C. and keeping its temperature for at least one hour in a temperature range of 500.degree. C.-350.degree. C.

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Amagasaki, Japan

Kimio Hashizume