Nuflare Technology, Inc.

Kabushiki Kaisha Toshiba

Kabushiki Kaisha Topcon

Kiminobu Akeno

Michihiro Kawaguchi

Toru Tojo

Soichiro Mitsui

Keisuke Yamaguchi

Keita Ideno

Yoshinori Kagawa

Kiyoshi Nakaso

Keisuke Goto

Shintaro Yamamoto

Hitoshi Matsushita

Munehiro Ogasawara

Toshiyuki Watanabe

Naoharu Shimomura

Yosuke Takahashi

Kiyoshi Hattori

Eiji Yamanaka

Kota Iwasaki

Mitsuo Tabata

Yuji Abe

Kenichi Kataoka

Kazuhiro Shiba

Jun Takamatsu

Tomohide Watanabe

Hitoshi Sunaoshi

Makoto Taya

Hirokazu Yoshioka

Chikara Itoh

Yu Asami

Shun Kanezawa

Ryouta Inoue

Yuuki Fukuda

Tomoki Umetsu

Ryota Inoue

Yuki Fukuda

According to one embodiment, a dust-collecting apparatus includes a main body with a first surface on which a back surface of a first electrode is disposed; a fixing unit configured to control attachment and detachment of the first electrode and the main body; a second electrode configured to transfer a voltage to the first electrode; and a control board configured to control a magnitude and a timing of a voltage which is applied to the second electrode.

Dust-collecting apparatus

A charged particle beam irradiation apparatus according to an embodiment includes: an optical column; a stage; a mount supporting the stage; a chamber provided on the mount and supporting the optical column; a detector configured to detect movement of the stage; actuator units each including a curved plate, a piezoelectric element, and a connector connected configured to transmit a first force generated by a change of the curvature of the curved plate to the mount; and an actuator control circuit configured to control the voltage applied to the piezoelectric element of each of the actuator units based on movement information, so that the first force is transmitted from the actuator units to the mount against a second force acting on the mount due to the movement of the stage.

Charged particle beam irradiation apparatus

The vibration control system configured to control vibration of a vibration-controlled object is disclosed. The vibration control system comprises: (i) actuator units each including a piezoelectric element configured to expand and contract; (ii) a drive power source configured to supply drive voltages to the piezoelectric elements of the actuator units for causing the piezoelectric elements to expand and contract; (iii) a vibration detector configured to detect a status of vibration of the vibration-controlled object; and (iv) a vibration controller configured to control the vibration of the vibration-controlled object by controlling the voltages supplied by the drive power source to the piezoelectric elements of the actuator units based on the status of vibration detected by the vibration detector, respectively.

Vibration control system and optical equipment equipped therewith

A conductive contact point pin includes a pin body, and a plurality of convex portions formed in a tip portion of the pin body, wherein the conductive contact point pin breaks, by pressing a substrate where a film to be broken is formed on a conductive film from above the film to be broken, the film to be broken in order to be electrically connected to the conductive film.

Conductive contact point pin and charged particle beam apparatus

A charged particle beam drawing apparatus according to one embodiment of the present invention comprises a load lock chamber provided for introducing a target object from the outside and capable of switching an atmosphere state and a vacuum state, a transfer chamber arranged so as to be able to communicate with the load lock chamber and transferring the target object, a soaking chamber arranged so as to be able to communicate with the transfer chamber and having a temperature adjustment container for housing the target object therein and controlling a temperature of the target object with radiation and a temperature adjustment part for controlling a temperature of the temperature adjustment container, and a drawing chamber arranged so as to be able to communicate with the transfer chamber and drawing on the target object at a constant temperature.

Charged particle beam drawing apparatus and charged particle beam drawing method

A charged particle beam writing apparatus according to one aspect of the present invention includes a substrate cover attachment/detachment unit to attach or detach a substrate cover that covers a whole periphery of a substrate being a writing target from an upper part, to/from the substrate, a writing unit to write a pattern on the substrate, in a state where the substrate cover is attached to the substrate, by a charged particle beam, a position measurement unit, before and after writing by the writing unit, to measure a position of the substrate cover in a state attached to the substrate, at a predetermined measurement position, and a correction unit, with respect to a position of the substrate to which the substrate cover is attached, to correct a positional deviation amount between a position of the substrate cover measured after writing and a position of the substrate cover measured before writing.

Charged particle beam writing apparatus and charged particle beam writing method

A substrate coverincludes a conductive portionhaving a shape corresponding to a peripheral edge region of a substrate. Since at least part of the conductive portion includes transmissive portionseach formed of a light transmissive member, it is configured so as to allow desired light to penetrate through. The position of each edge portion of the substrate is detected in such a manner that the substrate is disposed with the substrate coverplaced thereon between light irradiation means and a light detecting unit, irradiation light directed from the light irradiation means located above the substrate to the edge portion of the substrate is made to penetrate through at least part of the substrate cover, the edge portion of the substrate is then irradiated with light from the irradiation means.

Substrate cover and charged particle beam writing method using same

A charged particle beam processing apparatus includes a sample chamber to process a substrate including side faces by a charged particle beam, a movable stage in the sample chamber, the stage including a place on which the substrate is to be mounted, a height and position acquiring unit to acquire a height of the substrate on the stage by irradiating a laser beam onto the substrate on the stage and using the laser beam reflected from the substrate and to acquire positions of at least two adjacent side faces among the side faces based on the acquired height, and a calculating unit to calculate a position of center of gravity of the substrate on the stage and a rotation angle as to a rotary axis vertical to the place on which the substrate is to be mounted based on the positions of the at least two adjacent side faces.

Charged particle beam processing apparatus

An alignment method for substrates includes preparing an alignment apparatus having a movement mechanism to move a target substrate in horizontal and vertical directions, a rotation mechanism to rotate the substrate in a horizontal plane, an illumination tool to irradiate the substrate, an image sensor to pick up an substrate image, an edge position sensor to sense the substrate edge positions, and a control computer, transferring the substrate from a previous stage using the moving mechanism, measuring the substrate position using the image sensor which picks up the image on a back surface of the substrate, while irradiating the substrate with the illumination tool from a sidewise direction, calculating positional shifts regarding X, Y, and &#x3b8; of the mask, using the edge position sensor and control computer, correcting the positional shifts of the mask by the moving and rotation mechanisms, and transferring the substrate to a next stage.

Alignment method

An alignment apparatus for substrates comprises a first movement mechanism moving a substrate to be treated in a horizontal direction, a second movement mechanism moving the substrate in a vertical direction, a rotation mechanism rotating the substrate in a substrate plane, an illumination tool irradiating the substrate from a sidewise direction in a state where the substrate is held in a desired height position by the second movement mechanism, an image sensor picking up an image on a back surface of the substrate in an irradiated state, an edge position sensor sensing plural edge positions of the substrate from an image obtained by the image sensor, and a control computer obtaining a positional shift of the substrate based on the edge positions sensed by the edge position sensor and correcting a positional shift of the horizontal and rotation directions by the first movement and rotation mechanisms.

Alignment apparatus for substrates

A charged particle beam system includes a chamber having an opening in a ceiling, a table placed immediately below the opening and movable in one direction, a laser interferometer set in the chamber, including a laser oscillator placed along the moving direction of the table, a movable mirror placed on the table side opposing the oscillator, a beam splitter placed to cross the laser beam and a fixed mirror fixed, immediately above the beam splitter, on the ceiling of the chamber, an optical lens barrel having an opening communicating with the opening of the chamber, and a beam gun set on a ceiling of the optical lens barrel to irradiate a specimen placed on the table with a charged particle beam through the first and second openings. At least an upper wall portion from the opening to the fixed mirror of the chamber is made of an invar alloy.

Charged particle beam system and chamber of charged particle beam system

The present invention provides a pattern evaluating device including light irradiating means for irradiating the rays of light from a light source upon an object, an objective lens through which the light having penetrated through the object passes, an aperture member stopping the diameter of a light beam which has passed the objective lens, a photo receiving element receiving the light beam which has had the diameter stopped by the aperture member, and judging means for evaluating the pattern, following the information of the light received by the photo receiving element and which corresponds to the pattern, wherein the aperture member is capable of changing the numerical aperture, depending whether or not the sample is provided with a pericle.

Pattern evaluation apparatus and a method of pattern evaluation

Growing community of inventors

Yokohama, Japan

Kiminobu Akeno