Yamamoto-ms Co., Ltd.

Waseda University

Kimiko Koiwa

Wataru Yamamoto

Mikiko Saito

Takayuki Homma

Katsunori Akiyama

Tomoyuki Yamamoto

Yoshiaki Hoshino

Masazumi Ishiguro

There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (A) includes: a first anode (A) disposed in a first plating bathtub (A); an insulating substrate () having a hole () and disposed in the first plating bathtub (A); a pair of first cathodes (AX,AY), each cathode being provided in the insulating substrate () at a bottom portion of the hole () and at a surface on an opening side of the hole (); a first plating power source (A) configured to supply an electric current between the first anode () and the pair of first cathodes (AX,AY); and a first electric current measuring circuit (A) configured to measure respective values of electric currents flowing through the pair of first cathodes (AX,AY).

Plating apparatus and plating system

A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus () has an anode () and a pair of cathodes (X) (Y) which are provided in a plating bathtub (); a plating power source () to supply an electric current between the anode () and the pair of cathodes (X) (Y); and a feedback circuit () to have an electrode potential of a first cathode (X) equal to an electrode potential of a second cathode (Y) while a summation of electric currents flowing through the pair of cathodes (X) (Y) is kept constant.

Plating device

Growing community of inventors

Tokyo, Japan

Kimiko Koiwa