Dowa Electronics Materials Co., Ltd.

Kimikazu Motomura

Yutaka Hisaeda

Shuji Kaneda

Tatsuya Kariyasu

Kosuke Iha

Keiichi Endoh

Hiromasa Miyoshi

Satoru Kurita

There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 &#x3bc;m, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight.

Bonding material and bonding method using same

A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (D) of 5 to 100 nm as measured using a transmission electron microscope.

Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste

Fine silver particle powder, method for manufacturing the same, silver paste using the powder, and method of use of the paste

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Okayama, Japan

Kimikazu Motomura