Mitsubishi Materials Corporation

Kimihito Nishikawa

Yoshiyuki Nagatomo

Nobuyuki Terasaki

Yoshirou Kuromitsu

Sotaro Oi

Tomoya Oohiraki

Shuji Nishimoto

Hiromasa Hayashi

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate; a nitride layerthat is formed on the surface of the ceramic substratebetween the copper plate and the ceramic substrate; and an Ag&#x2014;Cu eutectic structure layerhaving a thickness of 15 &#x3bc;m or less that is formed between the nitride layer and the copper plate.

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

A method of manufacturing power-module substrates, after bonding copper-circuit platesat intervals on a ceramic platehaving an area in which ceramic substrates can be formed abreast, by dividing the ceramic platebetween the copper-circuit plates, in which: bonding-material layersof active-metal brazing material having same shapes as outer shapes of the copper-circuit platesare formed on the ceramic plate; temporal-stick materialincluding polyethylene glycol as a major ingredient is spread on the copper-circuit plates, the bonding-material layersand the copper-circuit platesare temporarily fixed on the ceramic platein a state of laminating with positioning by the temporal-stick material; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Manufacturing method of power-module substrate

There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.

Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer

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Gotenba, Japan

Kimihito Nishikawa