Tokyo Ohka Kogyo Co., Ltd.

Kimihiro Nakada

Akihiko Nakamura

Yasumasa Iwata

Yoshihiro Inao

Shigeru Kato

Satoshi Kobari

Hirofumi Imai

Takahiro Yoshioka

Atsushi Kubo

A laminate is directly transferred from a first robot arm that carries the laminate from a bonding chamber to an overlapping chamber, to a second robot arm that carries out the laminate from the overlapping chamber to the outside.

Carrying method and bonding apparatus

A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.

Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate

A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Bonding method

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Stripping device and stripping method

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

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Kawasaki, Japan

Kimihiro Nakada