Nichia Corporation

Kimihiro Miyamoto

Atsushi Bando

Naofumi Sumitani

Akira Otani

Tomohide Miki

Masaki Hayashi

Tadaaki Ikeda

Koji Abe

Dai Wakamatsu

Ryoji Naka

Yoshiyuki Kageyama

Takashi Tani

Shoji Hosokawa

Daisuke Iwakura

Yoshiyuki Aihara

Kensuke Yamaoka

Kosuke Sato

Yoshitaka Sumitomo

Yoshiyuki Ide

Satoshi Kinoshita

Tomoyuki Sato

A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.

Light emitting device

A light-emitting device includes a mounting substrate having a first surface and a second surface opposite to the first surface, the mounting substrate having a first end portion at an end of the mounting substrate; light-emitting elements mounted on the first surface of the mounting substrate other than the first end portion; first terminals provided on the first surface at the first end portion of the mounting substrate and connected to the light-emitting elements; and second terminals provided on the second surface at the first end portion of the mounting substrate and connected to the light-emitting elements.

Light-emitting device and light-emitting module

A light-emitting module includes a first mounting board having a first surface and a second surface opposite to the first surface. The first mounting board has a recess on the first surface, and the recess has a bottom surface. The first mounting board has an opening passing through the first mounting board from the bottom surface to the second surface. The light-emitting module further includes a second mounting board provided in the recess, a light-emitting element provided on the second mounting board and configured to emit light through the opening, and an elastic cushion provided between the first mounting board and the second mounting board. The light-emitting module also includes a connector. The connector and the opening sandwich a center of the first mounting board when viewed from a direction from the second surface to the first surface.

Light-emitting module

A light-emitting module includes a first mounting board which has a first surface, a second surface opposite to the first surface, and a recess on the first surface. An opening passes through the first mounting board from a bottom surface of the recess to the second surface. A second mounting board has a mounting surface and a light-emitting element surface opposite to the mounting surface and is provided in the recess such that the light-emitting element surface faces the bottom surface of the recess. A light-emitting element is provided on the light-emitting element surface and configured to emit light through the opening. An elastic cushion is provided between the bottom surface and the light-emitting element surface. The second mounting board projects from the first surface of the first mounting board when a force pressing the second mounting board toward the bottom surface of the recess is not applied.

A light-emitting moduleincludes a light-emitting element, a mounting board, a module board, an anode connection member, a cathode connection member, and a metal ribbon. The light-emitting element includes an anode electrode and a cathode electrode. The mounting board includes an anode pad, a cathode pad and a heat radiating pads, each of which is electrically independent. The anode electrode and the anode pad are connected. The cathode electrode and the cathode pad are connected. The module board includes an anode terminal, a cathode terminal and a heat sink. The anode connection member connects the anode pad and the anode terminal. The cathode connection member connects the cathode pad and the cathode terminal. The metal ribbon connects the heat radiating pads and the heat sink.

Light-emitting device, light-emitting module and method for manufacturing the same

A light emitting device includes a package having a recess which includes a bottom surface having corners. The package includes a first electrode, a second electrode, and a resin portion. The first electrode is provided at a first part of the bottom surface. The second electrode is provided at a second part of the bottom surface. The resin portion is provided between the first electrode and the second electrode at a third part of the bottom surface. A protection element is provided on the bottom surface. A light reflective material covers the bottom surface except for an uncovered region to cover the protection element and the corners of the bottom surface and uncovers an uncovering region of the bottom surface. The uncovered region is defined by linear lines and curved lines connecting the linear lines. A light emitting element is provided in the uncovered region on the bottom surface.

A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Package and light-emitting device

A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.

Light emitting device and method of manufacturing light emitting device

A light emitting device includes a package having a recess which includes a bottom surface. A first bottom surface of a first light emitting element is put on a first part of the bottom surface. A second bottom surface of a second light emitting element is put on the first part of the bottom surface. A first side surface of the first light emitting element is opposite to a second side surface of the second light emitting element with a gap. At least a part of the first side surface does not overlap with the second side surface viewed in a direction perpendicular to the first side surface. A protection element is provided at a second part of the bottom surface. A light reflective material covers the protection element.

Methods of manufacturing the package and light-emitting device

A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.

A light emitting device includes a light emitting element and a package. The package includes a first lead frame, a second lead frame, and a resin. The first lead frame has a first surface on which the light emitting element is provided. The first lead frame has a first overlap portion. The second lead frame is spaced apart from the first lead frame and has a second overlap portion. The first overlap portion and the second overlap portion overlap at an overlap position so that the first lead frame extends from the overlap position toward a first direction and a second direction opposite to the first direction and so that the second lead frame extend from the overlap position toward a third direction and a fourth direction opposite to the third direction as viewed along a line substantially perpendicular to the first surface.

Light emitting device and method for producing the same

A light emitting device is provided which includes a light emitting element, a phosphor, and a sealing member. The light emitting element has a light emission peak wavelength in the range not shorter than 400 nm and not longer than 460 nm. The phosphor can be excited by light from the light emitting element, and emit luminescent radiation with a light emission peak wavelength in the range in not shorter than 600 nm and not longer than 700 nm. The sealing member includes a pigment for absorbing a part of the light from the light emitting element. X of the light emission chromaticity of the light emitting device falls within the range of x&#x2267;0.600 in the chromaticity coordinates in the CIE 1931 color space chromaticity diagram.

A light emitting device includes a base structure, a wall, a light emitting element, a protection element, and a light reflective portion. The wall includes an inner peripheral surface defining an opening. The opening has a substantially polygonal shape in a planar view of the light emitting device. The light reflective portion has a maximum length which is longest in the light reflective portion. The maximum length is defined at a maximum-length position closest to the first corner among a plurality of positions defined in the light reflective portion. The light reflective portion has a minimum length which is shortest in the light reflective portion. The minimum length is defined at a minimum-length position arranged apart from the maximum-length position. The light reflective portion includes an inclined surface extending from the maximum-length position to the minimum-length position.

The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer. The second metal layer has an adhesion with respect to the translucent substrate higher than the adhesion between the first metal layer and the translucent substrate.

Growing community of inventors

Tokushima, Japan

Kimihiro Miyamoto