Kabushiki Kaisha Toshiba

Kimihiro Ikebe

Chiaki Takubo

Akio Katsumata

Seiichi Hirata

Masafumi Takeuchi

Sumio Takeda

A semiconductor chip has a shape of a quadrangle. Bumps are arranged in a staggered fashion along at least one side of the semiconductor chip, and include first bumps and second bumps arranged inside the first bumps. If each of the first bumps has a maximum width Bw1 and each of the second bumps has a maximum width Bw2 in a direction parallel to at least one side of the semiconductor chip, Bw2&gt;Bw1. If each of the first bumps has a maximum length Bd1 and each of the second bumps has a maximum length Bd2 in a direction perpendicular to at least one side of the semiconductor chip, Bd1&gt;Bd2.

Semiconductor device

Two device holes are formed in a base film such that the device holes are juxtaposed in a width direction of the base film perpendicular to a feed direction of the base film. An outer lead hole is formed in the base film with a distance from the device holes in the feed direction. A first lead wire group is arranged on the base film between the outer lead hole and one of the device holes, and a second lead wire group is arranged on the base film between the outer lead hole and the other device hole. Further, a third lead wire group is arranged on the base film between both device holes.

Lead carrier

TCP (tape carrier package) type semiconductor memory elements, each having a thickness less than that of the conventional package, are provided on the front and rear surface of a print circuit board in a stacking manner. Close to the semiconductor memory elements stacked, provided are TCP type semiconductor memory elements stacked one on another. Each TCP type semiconductor memory element has outer leads on its one side surface. The outer leads having the same function are arranged in a straight line on the front or rear surface of the print substrate. The outer leads arranged in the straight line are connected with each other via a straight wiring pattern.

Growing community of inventors

Urayasu, Japan

Kimihiro Ikebe