Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Fuji Electric Systems Co. Ltd.

Kimihiro Ashino

Katsumichi Ueyanagi

Kazunori Saito

Shigeru Shinoda

Katsuyuki Uematsu

Mutsuo Nishikawa

Fumiya Ueno

Toshiaki Kaminaga

Eisuke Sato

Jun Kubo

A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

Semiconductor package, resin molded product, and method of molding resin molded product

A sensor device for measuring a physical quantity. The sensor device includes a sensor element having a semiconductor chip, a first terminal electrically connected to the sensor element, and a housing portion having a terminal, which is a second terminal and is electrically connected to the first terminal. The second terminal has a through-hole formed therein, the through-hole having a first end and a second end opposite to each other, an inner surface of the through hole at the first end being an R-surface that is a curved surface with a radius R. The first terminal is housed in the housing portion, and has one end thereof inserted in the through-hole from the first end of the through-hole.

Physical quantity sensor device including curved through-hole

Pressure sensor

A first connector pin to a third connector pin have a substantially L-shaped cross-sectional shape formed by a horizontal part embedded in the top of an inner housing part by resin molding and a vertical part continuous with and protruding upwardly orthogonal to the horizontal part. A fourth connector pin has a substantially I-shaped cross-sectional shape having only the vertical part. The horizontal part of the first connector pin is provided so as to surround the first end of the first connector pin, the horizontal part and the first end of the second connector pin, the horizontal part and the first end of the third connector pin, and is integrated and connected to the fourth connector pin. A chip capacitor is attached to the connector pins by a joining member. Thus, the connector pins are connected to each other via the chip capacitors.

Method of manufacturing physical quantity sensor device and physical quantity sensor device

Provided are a pressure sensor device and method for making the same. A base member and a pressure sensor chip are joined so that a pressure receiving portion is aligned with a through hole. A pressure introduction unit and the base member are positioned and joined so that through holes thereof are continuous. The pressure introduction unit has a stepped portion in an end portion on an opened end side, and has a protruding portion protruding from the stepped portion to the base member side in an end portion.

Pressure sensor device and pressure sensor device manufacturing method

A pressure sensor includes a socket portion and a nut portion which are integrally molded with resin, a screw portion which is tightly fixed to a side wall of an opening in a concave part of the nut portion by adhesive, and a sense element which is fixed to the screw portion and is disposed in the concave part of the nut portion. The socket portion, the nut portion and the screw portion constitute a package. A through hole introducing the pressure measurement target liquid is formed in the screw portion. An external lead-out terminal is fixed to the sense element. The external lead-out terminal passes through the through hole on a base of the concave part of the nut portion, and is tightly fixed to the socket portion with adhesive. The external lead-out terminal is a connection terminal to be connected with external wiring.

Physical quantity sensor and method of manufacturing physical quantity sensor

A double diaphragm type pressure sensor includes a metal container having a concave portion; a pressure sensor unit mounted on a bottom of the container; a metal diaphragm airtightly bonded to an opening portion of the concave portion of the container; a pressure transmission medium filling a space formed by the metal diaphragm and the concave portion of the container; and a metal terminal penetrating the bottom of the container and being electrically insulated from the container.

Double diaphragm type pressure sensor

An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.

Pressure sensor package having a groove provided in a wall surface of the pressure inlet pipe

A lead frame which is disposed in an outer package is composed of three members. The lead frame is provided with contact electrodes, connector terminals, and conductive interconnections which are connected to the respective connector terminals. The arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively; that is, the arrangement direction of the contact electrodes is the same as that of the connector terminals. On the other hand, the arrangement order of the contact electrodes is such that contact electrodes are connected to the connector terminals, respectively, that is, the arrangement direction of the contact electrodes is opposite to that of the connector terminals. Lead terminals of a resin cell package are connected to the contact electrodes.

Semiconductor device and method of manufacturing same

An integrated sensor includes a pressure sensor integrated with a temperature sensor. When the sensor is attached to an object of attachment at a mounting position at an angle of &#x3b8;degrees with respect to an ideal attachment position, in which a central axis of at sensor body element of the temperature sensor element is disposed perpendicular to a direction in which a gas to be measured passes through the object of attachment, an inclination angle &#x3b8;at which the central axis of the sensor body element is inclined at the mounting position with respect to a position of the central axis of the main body element at the ideal attachment position is set according to the following equation:(&#x3b8;&#x2212;&#x3b8;)&#x2266;&#x3b8;&#x2266;(&#x3b8;+&#x3b8;)

Growing community of inventors

Matsumoto, Japan

Kimihiro Ashino