Mitsu Chemicals, Inc.

Mitsui Chemicals, Inc.

Kimihiko Saito

Yuichi Ito

Yugo Yamamoto

The bonding method of the present invention is a method of bonding a member (a) having a layer (a) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a). The composite film of the present invention is, firstly, a composite film formed with a laminate having a layer (a) comprising an organic polymer (A) and a layer (c) comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom; secondly, a composite film formed with a laminate having the layer (a), the layer (c) and a layer (b) comprising an adhesive resin (B) disposed in this order, wherein the layer (c) and the layer (b) are directly laminated; and thirdly, a composite film formed with a laminate having the layer (a), the layer (c), and a transparent conductive layer (d) disposed in this order, wherein one outermost surface or both outermost surfaces of the composite film are partially formed with the layer (c).

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Chiba, Japan

Kimihiko Saito