Murata Manufacturing Co., Ltd.

Kimiharu Anao

Keiichi Shimamaki

Mitsuro Hamuro

Masaharu Konoue

Fumihiko Kaneko

Yoshitsugu Hori

Shigeyuki Horie

Tadashi Sato

Takashi Kawamura

A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent electrical properties, without experience the occurrence of structural effects such as cracking, delamination, or other structural defects. Conductive paste is prepared to contain conductive particles and resin particles having a thermal decomposition-ability. The resin particles have an average particle size of about 0.25 to about 1.50 times the average particle size of the conductive particles. The volume ratio of the resin particles is in the range of about 0.5 to about 1.0 the volume of the conductive particles. The conductive paste is applied to the surface of a ceramic layer to form a conductor layer. The ceramic layers and the conductor layers are alternately laminated. The laminate is fired to form a ceramic sintered laminate. Thus, a laminated electronic component is produced.

Method for manufacturing laminated multilayer electronic components

A conductive paste contains a metal powder as the conductive component, and an organic vehicle. The metal powder is mainly composed of silver, and has an average particle diameter of about 1.5 to 3.5 &mgr;m. The cumulative volume percent of particles of the metal powder which are within the average particle diameter &plusmn;0.5 &mgr;m in a particle-size distribution is about 40% or less. The average particle diameter and the cumulative volume percent are measured with a laser diffraction/scattering analyzer. The conductive paste can be used to form inner electrodes of a composite inductor.

Conductive paste

A chip type electronic part has an outer electrode structure appropriate mainly for reflow soldering. An outermost layer of the outer electrode, provided at both end portions of the chip type electronic part, is to be soldered and made of a metal having a solidus temperature lower than 183.degree. C. and a difference not smaller than 10.degree. C., or more preferably not smaller than 30.degree. C., between its liquidus temperature and its solidus temperature, and is formed of a plating coat. The above-mentioned arrangement allows reflow soldering for the mounting of the chip type electronic part onto a substrate to be achieved at a low temperature while preventing the harmful influences of high-temperature soldering, and prevents the tombstone phenomenon in the soldering process.

Outer electrode structure for a chip type electronic part appropriate

A mounting arrangement of a chip type component onto a printed circuit board, which includes a chip type component having terminal electrodes at its opposite end portions, and land portions provided on a printed circuit board so as to fix the chip type component on them by soldering through cream type solder applied onto the land portions. The land portions are each formed to have such a length as will not project externally in a longitudinal direction of the chip type component.

Mounting arrangement of chip type component onto printed circuit board

In an electronic component series of the type wherein a plurality of electronic components are distributed in the longitudinal direction of a tape-like receiving member to be retained by the same, a cover tape is heat-sealed to a receiving tape having receiving concavities for receiving the respective electronic components. Stepped portions or protrusions are forned in the receiving tape to define regions not in contact with the cover tape. This restricts the extent of the sealed regions wherein the cover tape is heat-sealed to the receiving tape, such that the sealed regions are substantially constant in width which results in a substantially constant force being required for removing the cover tape from the receiving tape.

Electronic component series

A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.

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Nagaokakyo, Japan

Kimiharu Anao