Fujitsu Corporation

Mitsubishi Electric Corporation

Kimiaki Sato

Yoshihiro Takemae

Tomio Nakano

Masao Nakano

Nobumi Kodama

Shigeki Nozaki

Makoto Yanagisawa

Takashi Horii

Yasuhiro Takada

Junji Ogawa

Hirohiko Mochizuki

Yasuhiro Fujii

Akira Kaneko

Takeo Tatematsu

Satoru Nakai

Hatsuo Miyahara

Norihisa Tsuge

Akira Ishihara

Satoshi Momozono

Sachie Tsuge

Hirohisa Furuta

Itaru Tsuge

Tool Khono

Takeo Takematsu

Takashi Tsuboi

A program analysis support device that can freely combine program analysis conditions and can realize desired program analysis. An analysis condition setting part inputs a program analysis condition in a form of a conditional equation (analysis command, an analysis subject, and analysis condition) having an inherent equation number. A POU list extraction processing executing part executes an analysis command that reads a program to generate a collection of POUs serving as analysis subjects constituting the program, and a variable use list extraction processing executing part executes an analysis command that extracts a cross-reference of a variable to extract a cross-reference of a variable to the POU collection serving as the analysis subject. Both the parts further extract a cross-reference of a variable to another POU collection. An AND processing part further performs processing of a logical product of the cross-references of both the variables and outputs a result thereof to an analysis result display part.

Program analysis support device

A semiconductor integrated circuit device having a fuse-blown type ROM for storing information concerning defective bits for the replacement of defective bits in a semiconductor memory device, etc., with redundant bits. The integrated circuit device comprises fuses for constituting the ROM, pads for supplying a melting current to the fuses, and PN junctions each being formed, for example, by a semiconductor substrate and a diffusion layer formed on the semiconductor substrate. Each of the fuses is melted by applying voltage to a circuit connecting the PN junction, the fuse, and the pad so that the PN junction is forward biased, thereby supplying a large current to the fuse.

Integrated circuit device

In a semiconductor memory device, a decoder circuit is located between first and second memory cell arrays. A sequence of driver circuits in the decoder circuit is provided as driver circuits common to the first and second memory cell arrays. The output terminal of the driver circuit is connected directly with a data input/output portion for the first memory cell array and connected with another data input/output portion for the second memory cell array through wirings traversing the decoder circuit.

Semiconductor memory device having common driver circuits for plural

A semiconductor memory device includes a write data transfer unit; a plurality of groups of sense amplifiers; a plurality of word lines; and a plurality of pairs of bit lines. Each of the pairs of bit lines includes a pair of inside bit lines, extending between the write data transfer unit and each of the sense amplifiers, and a pair of outside bit lines, extending from each of the sense amplifiers to the side opposite the side of the write data transfer unit. A plurality of memory cells is connected between the word lines and the pairs of bit lines, respectively. The drive timing of a selected one of the groups of sense amplifiers, connected to the selected one of pairs of bit lines on which the transfer of the write data is being performed, is delayed when compared with the drive timing of the sense amplifiers connected to the remaining pairs of bit lines on which the transfer of the write data is not being performed. The write data is transferred from the write data transfer unit to a part of the memory cells connected to a selected one of outside bit lines connected to the selected one of the groups of sense amplifiers. Further, it is also possible to stop the drive of the selected one of the groups of sense amplifiers connected to the selected one of pairs of bit lines on which the transfer of the write data is being performed, instead of delaying the drive timing of the selected one of the groups of sense amplifiers.

Semiconductor memory device having sense amplifiers with delayed and

A one-transistor one-capacitor type semiconductor memory device having a detection circuit for detecting the electric potential of a word line, to determine an appropriate timing for driving a sense amplifier, thereby improving the speed of memory operations.

Semiconductor memory device with a detection circuit to detect word line

A semiconductor dynamic memory device having an improved refreshing time is disclosed wherein the memory device provides two buffer memories exclusively for the external and refresh addresses, each of the buffer memories comprising a preamplifier and a driver stage. When the falling edge of a RAS signal is detected, all the circuits are enabled in parallel, but the operation of the driver is suppressed. As soon as a CAS before RAS detector discriminates which of the falling edges of the CAS and RAS signals becomes low earlier, it sends an address driving signal to one of the drivers, and the external address or refresh address are sent immediately. Using this technique, the prior art sequential operation of discriminating the falling edges of RAS and CAS signal, sending the refresh signal, receiving it and switching the circuit from external address to refresh address is eliminated, and is replaced by a parallel operation. Thus the set up time of the dynamic memory is reduced to 1-2 n.sec. by the present invention.

Semiconductor dynamic memory device having improved refreshing

In a semiconductor integrated circuit having first and second power supply lines for receiving a power supply voltage, an external input terminal for receiving an input signal, and a high voltage detection circuit for detecting at the external input terminal a high voltage higher than a predetermined voltage which is higher than the power supply voltage, the high voltage detection circuit comprises an input circuit connected to the external input terminal for generating circuit for generating a reference voltage; and a differential voltage amplifier connected to receive the detection voltage and the reference voltage for amplifying the difference between the detection voltage and the reference voltage, to thereby determine whether the high voltage is applied, the input circuit comprising; a level shift element connected to the external input terminal for providing the detection voltage; an impedance element connected between the level shift element and the second power supply line; and a leak current compensating element connected between the first power supply line and the level shift element for allowing a current to flow from the first power supply line through the leak current compensating element and the impedance element to the second power supply line when the high voltage is not applied to the external input terminal.

Semiconductor integrated circuit having function for switching

A semiconductor memory device including: a substrate; a plurality of word lines; a plurality of bit lines; and a plurality of memory cells, each positioned at an intersection defined by one of the word lines and one of the bit lines and including a transfer transistor and a capacitor. Each of the memory cells has a first insulating layer covering a gate of the transfer transistor. The capacitor in each memory cell includes a second conductive layer which contacts one of source and drain regions of the transfer transistor in the memory cell, through the first insulating layer, and extends over the gate of the transfer transistor, a second insulating layer formed on the first conductive layer, and a second conductive layer extending over the second insulating layer. The semiconductor memory device further includes an additional conductive layer directly connected to the other of the source and drain regions of the transfer transistor in the memory cell, through the first insulating layer covering same, and extending over the gate of the adjoining transfer transistors. Each bit line is connected to the other of the source and drain regions through the additional conductive layer. A method for manufacturing a semiconductor memory device having the above construction.

Semiconductor memory device having stacked-capacitor type memory cells

A semiconductor integrated circuit including a memory unit for storing address information of a failed circuit portion and for replacing the failed circuit portion by a redundant circuit portion. The semiconductor integrated circuit provides a comparison unit for detecting coincidence between data read from the memory unit and a received input address. Data produced from the comparison by the comparison unit is delivered through an external connection terminal.

Semiconductor integrated circuit with redundant circuit replacement

A dynamic semiconductor memory device including memory cells divided into a plurality of blocks (1-1, 1-2). A simultaneous write enable circuit performs a write operation simultaneously upon the plurality of blocks, and a comparison circuit compares read data of one block with read data of the other block, thereby carrying out a test.

Dynamic semiconductor memory device having a simultaneous test function

In a semiconductor integrated circuit comprising an internal circuit, a device for receiving a chip select signal from the outside, a device for receiving an input signal from the outside, and a voltage detecting circuit for detecting whether or not the potential of the input signal is higher than a reference potential; the voltage detecting circuit comprises a first device for differentially comparing the potential of the input signal with the reference potential and generating an output potential in accordance with the results of the comparison, a second device for detecting a predetermined edge of the chip select signal so as to trigger the first device, and a third device for latching the output potential of the first device to the third device when the first device is triggered by the second device, the internal circuit being switched from a first mode to a second mode, or vice versa, in accordance with the output potential of the third device.

A semiconductor memory device comprises a memory cell array, a bit line charge-up circuit coupled to one of a plurality of pairs of bit lines from the memory cell array for initially charging up the one pair of bit lines to a first voltage which is lower than a power source voltage used to drive the semiconductor memory device, an active restore circuit coupled to the one pair of bit lines and a switching circuit coupled to the one pair of bit lines for disconnecting the one pair of bit lines into a first pair of bit line sections on the side of the memory cell array and a second pair of bit line sections on the side of the active restore circuit after the one pair of bit lines are initially charged up to the first voltage. The active restore circuit charges up one of the pair of bit line sections on the side of the active restore circuit to a second voltage which is higher than the first voltage depending on a datum read out from the memory cell array.

Semiconductor memory device

A semiconductor memory device capable of compensating for variation in a discriminating voltage of a memory cell comprising a memory cell and a gate circuit for coupling the memory cell to a bit line. The device has a precharge circuit for precharging the bit line pair to a predetermined resultant precharge voltage in a reset state. The precharge circuit precharges a bit line pair with the resultant precharge voltage obtained by adding a compensating voltage to a precharge voltage in the reset state. The compensating voltage is adapted to compensate for variation in a memory cell discriminating voltage based on variation in a memory cell voltage caused by capacitive coupling of a word line to a memory capacitor due to a parasitic capacitance of a gate circuit in the active state, and the precharge voltage is adapted to optimize the memory cell discriminating voltage when it is assumed that the parasitic capacitance is not present.

Semiconductor memory device having a circuit for compensating for

A semiconductor memory device has an operational mode such as a nibble mode or page mode, a first address strobe signal is kept in an active state, and a second address strobe signal is successively switched between an active state and standby state, thereby enabling successive data output. Previous output data is reset once, in accordance with the switchover of the second address strobe signal to the active state while the first address strobe signal is in the active state, before outputting data, and the reset operation for outputting is also performed when both the first and second address strobe signals are switched to the standby state, so that the period in which the data is output is expanded.

Semiconductor memory device having extended period for outputting data

A booster circuit including a precharge capacitor (C.sub.2), a precharge driver circuit (20) having a first bootstrap circuit (C.sub.59, Q.sub.58, Q.sub.61) and precharging a voltage to the precharge capacitor in a reset mode, and an output driver circuit (19) having a switching circuit (Q.sub.21) for cutting off the output of the precharged voltage of the precharged capacitor in the reset mode and a second bootstrap circuit driving the switching circuit in an operation mode. The booster circuit further includes an additional switching circuit (Q.sub.1) for outputting a voltage to be superimposed onto the precharge voltage in the operation mode. The booster circuit may be applicable to a dynamic semiconductor memory device, for boosting a voltage of a word line at a high speed and for improving integration.

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Tokyo, Japan

Kimiaki Sato