Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Kimiaki Nakaya

Atsushi Tanaka

Naomi Nishiki

Hidetoshi Kitaura

Kazuhiro Nishikawa

Kenichiro Suetsugu

Arata Kishi

Shigeki Sakaguchi

Atsushi Yamaguchi

Akio Furusawa

Koso Matsuno

Ryo Kuwabara

Honami Nawa

Hiroe Kowada

Katsufumi Shimanaka

Henrik Rønnow

Akiyoshi Azechi

Provided is a graphite plate, consisting essentially of: graphite; and pores, wherein said graphite plate has a porosity from 1% to 30%. Further provided is a method for producing a graphite plate, including: applying welding pressure to at least one glass-like carbon material in a state in which said at least one glass-like carbon material is maintained in an inert atmosphere under heating conditions, to produce a graphite plate having a porosity from 1% to 30%.

Graphite plate and production method thereof

A graphite material has a flexible part and can be utilized as a heat-conveying material in a narrow space. The graphite material, includes: at least one heat-conveying part; and a flexible part. A method for producing a graphite material, includes: (i) subjecting at least one film serving as a material to a heat treatment to obtain at least one carbonaceous film; (ii) providing a monolayer or multilayer structure including the at least one carbonaceous film; and (iii) applying heat and pressure to at least one part of the monolayer or multilayer structure in an inert atmosphere.

Graphite material and production method thereof

A graphite-silicon composite, including: graphite; silicon; and an intermediate layer that is located between the graphite and the silicon, wherein the intermediate layer includes oxygen, carbon and silicon. Furthermore, provided is a method for producing a graphite-silicon composite, including: layering graphite and silicon; and heating the layered graphite and silicon while applying pressure to them, wherein, during heating the layered graphite and silicon while applying pressure to them, an oxygen concentration in the atmosphere is adjusted to 0.2 vol %, the applied pressure is adjusted to 24.5 MPa or higher, and the heating temperature is adjusted to 1260&#xb0; C. or higher.

Graphite-silicon composite and production method thereof

The clothing having a frontal land and a rear land includes: a thermal storage unit provided on at least one portion of the frontal land of the clothing; and a planar thermoconductive sheet located in a planar between the frontal land and the rear land, the planar thermoconductive sheet having a thermal conduction path to the thermal storage unit, and the planar thermoconductive sheet being higher in thermoconductivity than the frontal land and the rear land. The planar thermoconductive sheet includes a resin component and graphite particles. Basal plane of each graphite particle is parallel to the direction of the plane of the planar thermoconductive sheet.

Clothing having cooling function or warming function

A dispersion of suspended single-layer graphene, multilayer graphene, and graphite is used. A magnetic field is applied to the dispersion to separate the single-layer graphene from the dispersion. By applying the magnetic field, the single-layer graphene, the multilayer graphene, and the graphite are situated at different locations in solvent by the difference in the diamagnetism strengths of the single-layer graphene, the multilayer graphene, and the graphite.

Method for producing graphene

A heat conductor includes a first layer containing a first resin component and first flake graphite fillers each having a basal plane; and a second layer containing a second resin component and second flake graphite fillers each having a basal plane. The heat conductor is a laminate including the first layer and the second layer, an average of first angles in the first layer is 35 degrees or smaller, each of the first angles is an acute angle between the basal plane of a corresponding one of the first flake graphite fillers and a first laminated surface of the laminate, an average of second angles in the second layer ranges from 55 degrees to 90 degrees, and each of the second angles is an acute angle between the basal plane of a corresponding one of the second flake graphite fillers and a second laminated surface of the laminate.

Heat conductor and device including the same

An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 &#x3bc;m to 300 &#x3bc;m, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15&#xb0;.

Anisotropic heat conductive composition

The present invention relates to an anisotropic heat conductive composition including flake graphite particles and a resin composition for the particles to be dispersed therein. When the particles have a basal plane, a maximum diameter a in a direction of the basal plane, and a thickness c perpendicular to the basal plane, a/c is 30 or more on average, and a content of the particles is more than 40 mass % and 90 mass % or less. Since the composition includes the particles having a particular shape, when it is formed into a sheet, an anisotropic heat conductive path can be efficiently created therein. Thus, the present invention can provide a molded product in sheet form, suited to have therein a heat conductive path capable of dispersing heat from a high temperature region to a low temperature region.

Anisotropic heat conductive composition and molded product thereof

A graphite structure includes a graphite plate () that is made of a highly heat conductive material and has a thickness of 15 &#x3bc;m or less. A Ti layer () having a thickness of 10 nm to 200 nm covers the inner surfaces of through holes () penetrating the laminate of the graphite plate () from the front side to the back side of the laminate. Furthermore, continuous holes () are formed inside the through holes (). This configuration can achieve a smaller thickness and high reliability while keeping high thermal conductivity of graphite.

Graphite structure, and electronic device using the same

A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.

Mounting structure and electronic equipment

A bonding material that has a melting temperature of 270&#xb0; C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.

Bonding material, electronic component, bonding structure and electronic device

The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Flow soldering apparatus and flow soldering method using a water content sensor

A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Growing community of inventors

Osaka, Japan

Kimiaki Nakaya