Manufacturing Integration Technology Ltd

MIT Semiconductor Pte Ltd

Kim Mone Kwong

Kok Yeow Lim

Teck Keong Boh

Xiang Zhang

Han Yong Lam

Zhi Qiang Mao

Siew Hua Ng

Siong Huat Neo

Zhiqiang Mao

The present invention includes a transfer system for flipping and checking electronic devices. A first rotary device has a plurality of transfer heads configured to pick electronic devices from a wafer table and place the electronic devices on a transfer head of a second rotary device. Check stations can be positioned around the first and second rotary devices and configured to inspect or check the electronic devices during the flipping process. The transfer system can further include an imaging device to inspect the accuracy of picking and placing of the electronic devices during the flipping process. The wafer table and the first rotary device are inclined to increase the operation space. The system accurately picks, flips and transfers chips at a high operation speed.

Transfer system for flipping and multiple checking of electronic devices

A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations.

Laser scribing of thin-film solar cell panel

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

System and method for peeling a semiconductor chip from a tape using a multistage ejector

The present invention describes an adaptive clamp width adjusting device () for use in an integrated circuit package process machine. The device () includes a travel component () and a fixed component (). The travel component () carries a clamp () with an adjustable width and a rotary screw () operable for such adjustment by a driven wheel (). The fixed component (), mounted on a base plate (), includes a motor () and a drive wheel () attached to the motor shaft. When the device () is in a clamp width conversion station (), the travel component () is aligned above the fixed component () so that when the base plate () is raised and the drive wheel () engages the driven wheel (), the clamp width is operable to be adjusted by the motor () according to a width of a workpiece (W).

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Singapore, Singapore

Kim Mone Kwong