Advanpack Solutions Pte Ltd.

Lucent Technologies Inc.

Agere Systems Guardian Corp.

Kim Hwee Tan

Kok Hua Chua

Ching Meng Fang

Yin Yen Bong

Jimmy Hwee Seng Chew

Ch'ng Han Shen

Lim Tiong Soon

Shikui Lui

Balasubramanian Sivagnanam

Rosemarie Tagapulot

Jinhan Ju

Ma L Nang Htoi

A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.

Die pillar structures and a method of their formation

A predetermined amount of solder ( ) is deposited on the free ends of copper posts ( ) extending from die pads of a semiconductor die ( ). The solder ( ) is coated with flux ( ) and the semiconductor die ( ) is placed on a leadframe ( ) with the solder deposits ( ) abutting interconnect locations ( ) on inner lead portions ( ). When reflowed, the solder deposits ( ) melt and with the assistance of the flux ( ) forms solder interconnects between the free ends of the copper posts ( ) and the interconnect locations ( ). Due to the predetermined amount of solder ( ) deposited on the free ends of the copper posts ( ), the molten solder ( ) tends not to flow away from the interconnect location ( ). Thus, advantageously allowing a substantial portion of the solder deposit ( ) to remain at the interconnect locations ( ) to form solder interconnects.

Method for forming a flip chip on leadframe semiconductor package

A mold has at least one vent hole formed in the mold. The vent hole is positioned to allow egress of air from the mold. The vent hole has an inside end and an outside end. The vent hole has a cross section that increases in area from the inside end to the outside end. The vent hole may have a shape of a trapezoidal prism, a truncated pyramid or a truncated cone; the cross section of the vent hole may be a rectangle. A preferred mold has three air vent holes at three corners of the mold. An integrated circuit is placed within the mold. A material to be molded is injected into the mold to encapsulate the integrated circuit. Mold cleaning is facilitated by the shape of the vent, and plastic flashes may be easily removed through the vent hole.

Encapsulated circuit using vented mold

An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface. The punch punches a cut in the substrate in the form of a straight line segment, without causing cracks in the solder resist layer of the substrate.

Method and apparatus for cutting a substrate

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Singapore, Singapore

Kim Hwee Tan