Cheil Industries Inc.

Kil Yong Lee

Dong Seon Uh

Jin Kyu Kim

Jae Sun Han

Jong Hyuk Eun

Youn Jo Ko

Jang Hyun Cho

A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.

Method of manufacturing semiconductor device including thermal compression

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Semiconductor device bonded by an anisotropic conductive film

Growing community of inventors

Uiwang-si, South Korea

Kil Yong Lee