Samsung Electronics Co., Ltd.

Other

Taewoong Medical Co., Ltd.

Starmed Co., Ltd.

Shin, Kyong-min

Kil-Soo Kim

Myung-Kee Chung

Min-Keun Kwak

Kyung-Hoon Shin

Dong-Un Kim

Kyung-Min Shin

Provided is a combinable electrode needle base structure in which a base to which electrode needles are coupled can be used in a combined or separated state to use the electrode needles according to the size and location of a lesion. In the combinable electrode needle structure, electrode needles are connected to the front side of an electrode needle base, and receive RF waves from RF (radio frequency) generator. The electrode needle base is divided into dividable bases to which the electrode needles are respectively coupled. When a lesion to be cauterized is large or cauterization should be concentrated, the dividable bases are combined and then used, and when a lesion is small or lesions are scattered, the dividable bases may be separated and then used.

Combinable electrode needle base structure

This invention provides a semiconductor device. The semiconductor device includes a bonding pad array comprising: a signal bonding pad, a control pin bonding pad and at least one stacking bonding pad on an active surface. At least one stacking bonding pad is adjacent to the control pin bonding pad. This invention also provides a stacked structure of semiconductor devices and/or a semiconductor device package including the semiconductor device.

Stacked structure using semiconductor devices and semiconductor device package including the same

A semiconductor package has ball lands each configured to have a composite structure of SMD type and NSMD type. One peripheral portion of the ball land is covered with a mask layer, thus forming the SMD type, whereas the other peripheral portion is exposed through an opening area of the mask layer, thus forming the NSMD type. In one embodiment, the first peripheral portion is disposed to face a central point of a ball-mounting surface of a substrate, and the second peripheral portion is disposed to face the opposite direction to the central point. The composite structure of the ball lands provides more stable and enhanced connections between connection balls, such as solder balls, and the ball-mounting surface.

Semiconductor package with improved ball land structure

Growing community of inventors

Gyeonggi-do, South Korea

Kil-Soo Kim