Momentive Performance Materials Japan LLC

Kikuo Mochizuki

Hidefumi Tagai

Nobuo Hirai

Masahiro Fujita

Akira Takagi

Masanari Shimakawa

Kazuki Shinbo

To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.

Flame-retardant polyorganosiloxane composition, flame-retardant cured product, and optical member

There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.

Curable polyorganosiloxane composition and polyorganosiloxane cured product

To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.

Method of manufacturing silicone cured product, silicone cured product and optical member

A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25&#xb0; C.) of 10,000 to 500,000 mPa&#xb7;s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3&#x2264;a&#x2264;0.6, 0&#x2264;b&#x2264;0.1, 0.4&#x2264;c&#x2264;0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140&#xb0; C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.

Polyorganosiloxane composition for molding, optical member, light source lens or cover, and molding method

This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25&#xb0; C.) is 10,000 to 1,000,000 mPa&#xb7;s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si&#x2014;H content is 5.0 mmol/g or more, in which Si&#x2014;H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.

Flame-retardant polyorganosiloxane composition, flame-retardant cured product, optical member, light source lens or cover, and molding method

The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25&#xb0; C. of 1 to 1000 mPa&#xb7;s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25&#xb0; C. to 50&#xb0; C. is 40% or more. Specifically the polyorganosiloxane (A) is prepared by block or graft polymerization and equilibration reaction of three specific, different, organosiloxanes including a branched siloxane, a linear siloxane and a cyclic siloxane.

Silicone composition for sealing semiconductor

One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.

Silicone composition for sealing light emitting element, and light emitting device

A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO)(ViRSiO)(RSiO)(where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/(a+b+c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1 mol of a vinyl group bonded to a silicon atom in the component (A); and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10&#xd7;10to 290&#xd7;10/&#xb0; C. It is possible to obtain a cured product whose residual stress with a support substrate is reduced and which has long-term satisfactory and stable adhesiveness.

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Tokyo, Japan

Kikuo Mochizuki