Polymatech Co., Ltd.

Graftech International Holdings Inc.

Otsuka Electric Co., Ltd.

Kikuo Fujiwara

Jun Yamazaki

Julian Norley

Robert Anderson Reynolds, Iii

Gary D Shives

Mitsuru Ohta

Masaaki Tozawa

A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.

Sandwiched thermal solution

A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic layer provided on surface thereof. The average thickness of graphite sheet is 300 &#x3bc;m or less. Elastic layer is formed from an elastic composition containing a particulate heat-conducting filler. The average thickness of elastic layer is 10 to 280 &#x3bc;m. The average particle diameter of the heat-conducting filler is 50% or less of the average thickness of elastic layer. In the elastic composition, the content of the heat-conducting filler is 30% by volume or more, and the content of heat-conducting filler in which the average particle diameter is 95% or more of the average thickness of elastic layer is less than 15% by volume. The free space within case is less than 20% of the volume of case.

Heat-radiating sheet and heat-radiating structure

Growing community of inventors

Kawasaki, Japan

Kikuo Fujiwara