Mitsubishi Petrochemical Company Limited

Nisshin Steel Co., Ltd.

C.uyemura Co., Ltd.

Kikuko Tanaka

Fujio Matsui

Hitoshi Suzuki

Shoichiro Mori

Kazuhiko Ida

Setsuko Takahashi

Isao Saeki

Katsuhiko Ohara

Kayoko Oku

There is disclosed a non-aqueous electrolytic aluminum plating bath composition comprising an aluminum halide and a nitrogen-containing heterocyclic onium halide compound and containing an additive selected from the group consisting of an inorganic halide compound, aromatic aldehyde, ketone or carboxylic acid, an unsaturated heterocyclic compound containing more than one nitrogen atom, an unsaturated heterocyclic compound containing a sulfur atom, an aromatic hydrocarbon compound containing a sulfur atom, an aromatic hydrocarbon compound containing an amino group and an aromatic amine; and further optionally an organic polymer. The bath composition is easy in maintenance, has good covering power, and enables smooth plating with low current density.

Non-aqueous electrolytic aluminum plating bath composition

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Ichikawa, Japan

Kikuko Tanaka